r18 si产品新功能介绍.pdf

1 R18 SI产品新功能介绍 2 HFSS update： 宽带自适应网格 Broadband Adaptive Meshing. • 宽带宽带: : 用户自行设置感兴趣的频段用户自行设置感兴趣的频段 • HFSSHFSS自动确定频率点自动确定频率点 3 HPC任务提交: 分段独立设置 为仿真的每一步定义独立的HPC 资源 →Initial mesh →Adaptive mesh →Frequency sweep 在整个仿真过程中优化HPC资源 4 ANSYS Siwave R18 Update 5 R18 SIwave新功能 带感应线位置的多相电源模块 直流压降求解器与Mechanical和Icepak进行电热交互（焦耳热） 用于电源完整性分析的RLCG提取(SIwave-CPA Nexxim supports HSPICE syntax ** Uses Nexxim solver with PSPICE syntax 61 Receiver IC Driver IC A digital signal U7.(pin)60 U1.(pin)25 SNA provides: Zo@ void A Zo@ void B Void A on return current path Void B on return current path 1. Zo Profile & Delay for all paths of a signal. 2. Reflection Noise through transient analysis. 阻抗&飞行时间计算 Characteristic Impedance Voltage waveform at receiver IC 62 自动创建&求解仿真电路 63 NRZ and PAM-4眼图分析 64 ANSYS Q3D R18 Update 65 触屏设计 66 触屏&芯片封装网格刨分加速 “Phi Mesher” for Q3D →Targets Touch Panel Displays  Removes ACIS Processes  Surface Meshing “Cut Up” Advancement →Targets reduction of adaptive passes during Meshing Process Project Number Average Speed Up ~400% 15 inch Speed Up ~9 hours to 1.5 hours 67 Meshes planar structures in a fraction of the time Faster solution times with equal or better convergence Phi Mesher for Planar Structures Model R17 Total Solve Time R18 Total Solve Time R18 vs. R17 Total Solve time Speed Up R17 Meshing Time R18 Meshing Time R18 vs. R17 Mesh Speed Up R18 vs. R17 RAM Reduction Panel A 36hr 5min 13hr 7min 3x 10hr 51min 1hr 33min 7x 1.4x Panel B 14hr 38min 4hr 19min 3.5x 3h 17min 29min 7x 1.8x 68 Multi-physics: Thermal Coupling Temperature dependent AC and DC solutions Bi-directional power and heat mapping using Feedback Iterator Compatible with →Icepak →FLUENT →Mechanical Thermal Application Areas →Power Electronics →Power Conversion →Cable Modeling 69 Power Converter Design Predict parasitic performance to maximize Power Converter Efficiency Three-Phase Model Single-Phase Model 70 Power Converter Design Current @ DC Current @ 10 MHz NIGBT_DB1.IC -8.25 53.25 20.00 40.00 NIGBT_DB1.VCE -2.00 202.00 100.00 47.00m48.75m48.00m Switching On Switching Off NIGBT_DB1.IC -8.25 53.25 20.00 40.00 NIGBT_DB1.VCE -2.00 202.00 100.00 47.23m47.24m 47.26m47.27m NIGBT_DB1.IC -7.50 44.50 20.00 NIGBT_DB1.VCE -2.00 256.00 100.00 200.00 47.00m48.75m48.00m 47.26m47.27m NIGBT_DB1.IC -7.50 44.50 0 20.00 NIGBT_DB1.VCE -2.00 256.00 100.00 200.00 47.23m47.24m Switching On Switching Off 71 ANSYS Icepak R18 Update 72 Icepak R18 Added Mesh Level Support for SIwave Icepak solution Added automated iterative loop Improved Via handling capabilities Individually modeling vias – no K averaging Via Drill holes imported RedHawk CTM import with back annotation of Temps into RH Meshing Improvements Solver Improvments Vaccum - enable radiation control in fluid zones Mass & Heat fluxes across periodic surfaces Asymmetric periodic boundaries SpaceClaim Design Modeler incorporates DME “Simplify Functions” Arbitrary Board Outline Imports using IDF Improved Krylov ROM for efficient network modeling Post Processing LED – Efficiency as a function of temp. Solar Heat Flux reporting Improved Surface Probing Smooth 3D Contours Optimized Manhattan displays Transient option for “Full Reports” Plane Cut improvements - restrict to solid & fluid regions Node-weighted interpolation for accurate facet-based reporting Cu-brass 73 Icepak Vision - R18.1 & Beyond Create an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mesh/Solve Success Key Drivers/Mandates • Modern UI, Ease-of-Use • Integration into AEDT • Rapid Release Cycles R18.1 First release • Initial exposure with most common feature set • CPS with Enclosure • Steady-state thermal Improved Workflow • Native MCAD Modeler • ECAD-MCAD Assembly • Integrated Electro-Thermal Workflow • Geometry Clean Up & Simplification ANSYS Electronics Desktop (AEDT) • AEDT-Icepak 74 Icepak Summary 1. Long Term Commitment to Icepak that is MCAD & ECAD Centric 2. Icepak Vision - Streamlined Multi-physics Performance 3. Simplify Functions Placed into SpaceClaim & AEDT at R18 4. ANSYS Electronics Desktop Icepak Initial Release Planned for R18.1 5. Improvements to Release Process Enables Rapid Release Cycles for Customers 6. Streamlines the Unique Multi-physics flow for Icepak, Simplorer, & Maxwell 75 感谢聆听 76 LeadFrame Editor 77 Leadframe Editor Lead Frame Editor •Creates SIwave & 3D Layout Geometries •Creates HFSS & Q3D 3D Geometries Lead Frame Editor •SIwave QFP Package from Lead Frame Editor SIwave ANSYS Electronics Desktop 78 Open DXF Import DXF File → Imported DXF file is shown in the Editor. →All the layers are shown in the DXF Files… workspace Lead frame Editor Workflow Launch Lead frame Editor Import DXF Edit Cross Section Copy Geometry -Lead -Wire0 -Netname0 Build Polygon Net Assignment (Optional) Export to ANF/AEDT/SAT 79 Edit Cross Section Edit Cross Section → In the Cross section window  Mold and Die properties height can be assigned  On。