专业术语-英文翻译大集合整理.ppt

按一下以編輯母片標題樣式,,按一下以編輯母片文字樣式,,第二層,,第三層,,第四層,,第五層,,,*,专业术语大集合,,MVT: Mass Verification Test,多項驗證測試,,ORT: On Going Reliability Test,出貨信賴性測試,,,S/,W:software,,軟件,,H/W: hardware,硬件,,DCN: Design Change Notice,設計變更通知,,PVT: Production Verification Test,生產驗證測試,,,专业术语大集合,,MTF: Modulation Transfer Function,調整轉換功能,,CAT: Carriage Alignment Tool,載器調整具,,ID: Industrial Design,工業設計,(,外觀設計,),,PCBA: Printed Circuit Board Assembly,電路板組裝,,F/T: Function Test,功能測試,,专业术语大集合,,CCD: Charge Coupled Device,掃描器之讀器,,ERS: External Reference Spec,外部規格,,,PMP: Production Management Plan,工程管理計劃,,QA  Quality Assurance,質量保證,,QRA :Quality & Reliability Assurance,質量與可靠性保證,,MQA :Manufacturing Quality Assurance,製造質量保證,,DQA: Design Quality Assurance,設計質量保證,,QC: Quality Control,質量控制,,IQC: Incoming Quality Control,收益質量控制,,专业术语大集合,,VQC,: Vendor Quality Control,售貨質量控制,,IPQC: In Process Quality Control,制程質量控制,,OQ,C,: Out going Quality Control,出貨質量控制,,QE:  Quality Engineer,質量工程,,专业术语大集合,,AQL: Acceptable Quality Level,可接受的質量水平,,DPPM: Defective Pieces Per Million units,百萬件中有損件數,,PPM: Pieces Per Million,百萬分之一,,CS: Custom Service,顧客服務,,专业术语大集合,,MRB:,Material,Review Board,,DMR Defective Material Report,材料缺陷報告,,RMA: Return,Material,Administration,材料回收處理,,Life Test,壽命測試,,专业术语大集合,,T/C: Temperature Cycle,溫度循環,,H/T: High Temperature Test,高溫測試,,L/T: Low Temperature Test,低溫測試,,ISO: International Standard Organization,國際標準化組織,,SPC: Statistic process control,統計過程控制,,5S:,整理,.,整頓,.,清理,.,清掃,.,素養,,VMI: Visual Mechanical Inspection,外觀機構檢驗,,MIL-STD: Military Standard,美軍標準,,专业术语大集合,,SPEC: Specification,規格,,AVL: Approval Vendor List,合格廠商,,QVL: Qualified Vendor List,合格廠商,,,FQC: Final Quality Control,最終質量控制,,专业术语大集合,,OBA: Open Box Audit,成品檢驗,,EAR: Engineering Analysis Request,,FAI,: First Article Inspection,首件檢驗,,VQM: Vendor Quality Management,廠商質量管理,,CAR: Corrective Action Request,改進對策要求,,专业术语大集合,,4M: Man; Machine; Material; Method,人,,,機,,,材,,,方法,,,5M: Man; Machine; Material; Method;,Measurement,,人,,,機,,,材,,,方法,,,測量,,MTBF: Mean Time Between Failure,平均壽命,,TTL: Total,,,FIN,Finance &Accounting,,財務與賬目,,专业术语大集合,,P&L: Profit & Lose,,PV : Performance Variance,現象差異,,3 Element of Cost = M,L,O,,M:  Material,材料,,L:  Labor,人力,,Overhead,管理費用,,专业术语大集合,,Fix OH  Fix Overhead,固定管理費用,,Var,OH  Variable Overhead,不定管理費用,,COGS  Cost Of Goods Sold,工廠製造成本,,AR:  Account Receivable,應收,,AP: Account Payable,應支,,专业术语大集合,,MIS  Management Information System,資迅管理系統,,IS: Information System,資迅系統,,IT: Information Technology,系統技術,,MRP: Material Requisition Plan,材料需求計劃,,专业术语大集合,,I2:Information Integration System,資迅整合系統,,SAP: System Application Programming,系統申請項目,,,ERP: Enterprise Resource Programming,企業資源項目,,HR Human Resource,人力資源,,PR: Public relation,公共關係,,T/O: Turn Over Rate=Monthly T/O Total People*12,,专业术语大集合,,GR: General Affair,總務,,Organization,組織,,HQ  Head Quarter,總公司,,Chairmen,主席,,,,Lite,-On  Group,光寶集團,,专业术语大集合,,President,總裁,,Executive Vice President,常務副總裁,,Vice President,副總裁,,HR Human Resource,人力資源部,,FIN Finance,財務,,专业术语大集合,,Sales,銷售,,R&D: Research & Developing,研發部,,QA:,質量保證,QA  DQA CS,,MIS: Management Information System,資迅管理系統,,,PUR,採購,Purchasing,,IMD: Image Management Division,影像管理事業部,,专业术语大集合,,ITS: Information Technology System,電腦部,,QRA: Quality Reliability Assurance,品保部,,,MFG: Manufacturing,製造部,,PMC: Production & Material Control,生,(,產,),物,(,料,),管,(,理,),,专业术语大集合,,Materials,材料,,PC: Production Control,生產控制,,,MPS: Mass Production Schedule,量產計劃,FGI: Finished goods Inventory,成品存貨,,UTS: Units To Stock,存貨單元,,WIP: Working In Process Inventory,在制品,,专业术语大集合,,C/T: Cycle Time,循環時間,,,瓶頸,WD: Working Days,工作天,MTD: Month To Days,月初到今日,(,例如總表整理,) YTD: Year To Days,年初到今日,SO: Sales Order,銷售清單,MO: Manufacture Order,製造清單,BTO: Build  To  Order,訂單生產,P/N: Part Number,料號,MC: Material Control,材料控制,MRP: Material Requisition Plan,材料需求計劃,INV: Inventory,存貨清單,Inv Turn Over Days=INVS/NSB X WD,庫存周轉天數,PSI: Production Shipping Inventory,預備待出貨,JIT: Just In Time,即時,Safety Inventory,安全存量,CKD: Completed Kits Delivery,全件組裝出貨,SKD: Semi Kits Delivery,半件,(,小件,),組裝出貨,W/H: Warehouse,倉庫,Rec,: Receiving Center,接收中心,Raw MTL,原物料,,专业术语大集合,,F/G: finish goods,成品,Import/Export,進出口,SI: Shipping Instruction,發貨指令,PL: Packing List,包裝清單,Inv: Shipping Invoice,出貨發票,ETD: Estimate Arrive,預估離開時間,BL: Bill of Landing,提貨單,(,海運,) AWB: Air Way Bill,提貨單,(,空運,) MAWA: Master Air Way Bill,主提貨單,HAWB: House Air Way Bill,副提貨單,TEU: Twenty foot Equipment,Unit(Contain,),二十英尺貨櫃,FEU: Forty foot Equipment,Unit(Contain,),四十英尺貨櫃,CY: Container Yard,貨櫃場,THC: Terminal Handing Charge,碼頭費,ORC: Original Receiving Charge,碼頭費,PUR: Purchasing,採購,FOB: Free on Board,貨運至甲板,(,離岸價,) CIF: Cost Insurance Freight,成本,+,運費,+,保險,OA: Open Account,開戶,TT: Telegram Transfer,電匯,,专业术语大集合,,COD: Cash On Delivery CRP: Cost Reduction Program,降低成本方案,PR: Purchasing Requisition,採購申請,PO: Purchasing Order,採購單,MFG  Manufacturing Production,製造生產,DL: Director Labor,直接人工,IDL: Indirect Labor,間接人工,DLH: Direct Labor Hours,直接工時,Productivity=UTS/DLH PPH: Pieces Per Hour,每小時件數,Efficiency=Actual/Target(%) DT: Machine Down Time,停機時間,AI: Auto Insertion,自動插入,MI: Manual Insertion,人工插入,SMD: Surface Mount Device,表面粘著零件,SMT: Surface mount technology,表面粘著技術,B/I: Burn,In(for,how many hours at how many degree),燒機,WI: Work Instruction,工作說明,SOP: Standard Operation Procedure,作業指導書,R/I: Run In,運轉機器,ESD: Electrical Static Discharge,靜電釋放,MP: Mass Production,量產,,专业术语大集合,,,Engineer,工程,PE:  Products Engineer;,生產工程,Process engineer,制程工程,TE:  Test Engineer,測試工程,ME:  Manufacturing Engineer;,製造工程,; Mechanical Engineer,機械工程,IE:  Industrial Engineer,工業工程,DCC: Document Control Center,文管中心,BOM: Bill OF Material,材料清單,ECN:  Engineering Change Notice,工程變動公告,TECN: Temporary Engineering Change Notice,工程臨時變動公告,ATY: Assembly Test Yield     Total Yield,直通率,,TPM:  Total Productivity Maintenance   PM: Product Manager; Project Manager ECR: Engineering Change Request,工程變更申請,ECO: Engineering Change Request,工程變更指令,EN:  Engineering Notice,工程通報,WPS: Work Procedure Sheet,工作說明書,ICT: In Circuit Test,電路測試,P/R:  pilot  run;  C/R control run   T/R  trial run,試做,EVT: engineer Verification Test,工程驗証測試,DVT:  Design Verification Test,設計驗證測試,,英文簡稱 英 文 全 稱 中文解釋,VQA Vendor Quality Assurance,供應商品質保證,,IQC In-coming Quality Control,進料檢驗,,IPQC In-process Quality Control,,制程檢驗,,FQC Final Quality Control,,,最終品質控制,,LQC Line Quality Control,,線上,品質控制,,CQA Customer Quality Assurance,客戶品質保證,,F.P.Y.R First Pass Yield Rate,直通率,(,一次成功率,),,MRB Material Review Board,物料委員會,,PMP Process Management Plan,制程管理計劃,,SOP Standard Operation Process,,標準作業程序,,,,英文簡稱 英 文 全 稱 中文解釋,X-R Chart,平均值與全距管制圖,,X-,Rm,Chart,個別值與全距管制圖,,P Chart,不良率管制圖,,U Chart,單位缺點管制圖,,C Chart,缺點數管制圖,,Ca Capability of Accuracy,精確度,,,CP Capability of Precision,準確度,,CPK,制程能力分析,,S/N Serial Number,序列號,,Spec. Specification,規格,,英文簡稱 英 文 全 稱 中文解釋,,,英文簡稱 英 文 全 稱 中文解釋,,,,Pass,合格,,,Fail,失敗,,NG No Good,,不合格,,VER Version,版本,,ESD Electro-Static Discharge,靜電釋放,(,放電,),,DWG Drawing,圖紙,,ISO International Standard Organization,國際標準組織,,MBO Management By Objective,目標管理,,CAL Calibration,(,儀器,),校正,,NCR No-Calibration Requirement,,勿需校正,(,免校,),,英文簡稱 英 文 全 稱 中文解釋,,Statement of Conformity,,一致聲明（狀態）,,,License,執照,,,,Cyber Solution,,信元科技,,,RMA Procedure RMA,程序,,,Setup,,原始設定,,,Disc Setup,,磁片設定,,,Languages,,語言設定,,,TV Screen,,螢幕比,,,Digital Out,,數位輸出,,,Finish,,,,結束,,,Return,,跳出,,,Enter,,執行,,英文簡稱 英 文 全 稱 中文解釋,,OEM Original Engineering Manufacture,原廠委托製造,,,COMPAQ,美國,COMPAQ,電腦公司,,,Fujitsu,日本富士通公司,,HP Hewlett-Packard,美國惠普公司,,QM Quality Manual,品質手冊,,QP Quality Procedure,品質程序書,,WI Working Instruction,作業規範,,OJT On Job Training,在職訓練,(,工作中教導,),,FIFO First In First Out,先進先出,,4,M1E,Man Machine Material Method Environment,人,`,機器,`,材料,`,方法,`,環境,,英文簡稱 英 文 全 稱 中文解釋,,,RMA Return Material Authorization,客戶退回,,PPM Part Per Million 10,-6,(,百萬分之,…),,MIL Military(U.S),美,國軍事標準,,MIS Management Information System,管理,認證公司,,TUV,德國認證公司,,UL,美,國優力安全檢驗,,CE,歐,盟認證公司,,SGS,英國遠東公證,,PM Production Market,產,品市場,,M/N Manufacturing Notice,製造通告,,英文簡稱 英 文 全 稱 中文解釋,,DCC Document Control Center,資料中心,,,ECN Engineering Change Notice,工,程變更通知,,ECR Engineering Change Request,工,程變更需求,,DCN Document Change Notice,文件變更通知,,PE/ME,Product Engineering/Manufacture Engineering,產,品工程,/,製造工程,,EPR Engineering Pilot Run,工,程試作,,HR Human Resource,人,力資源,,IE/QE Industrial Engineering/Quality Engineering,工,業工程,/,品質工程,,R&D Research & Design,研究,開發,,PPR Production Pilot Run,生產試做,,英文簡稱 英 文 全 稱 中文解釋,,,AC/RE Accept/Reject,接收,/,拒收,,AQL Acceptable Quality Level,允收品質水準,,CR Critical Defect,嚴重缺點,,MA Major Defect,主要缺點,,MI Minor Defect,次要缺點,,QVL Qualified Vendor List,合格品質管理,,TQM Total Quality Management,全面品質管理,,PDCA Plan Do Check Action,計劃,`,實施,`,檢查,`,行動,,MTBF Mean Time Between Failures,平均失效間隔時間,,QCDS Quality Cost Delivery Service,品質,`,成本,`,交期,`,服務,,英文簡稱 英 文 全 稱 中文解釋,SPC Statistical Process Control,,統計制程管制,,FMEA Failure Mode Effective Analysis,失,效模式分析,,SWOT Strength Weakness Opportunity Threat,強,勢,,,弱勢,,,机會,,,危机,,ORT On-going Reliability Test,持,續可靠度實驗,,DMR Defect Material Review,不,良材料審核,,SCAR,Supplier Corrective Action Requirement,,供,應商矯正措施需求,,GR&R,Gauge Reproducibility and Repeatability,量,測系統再生性與再現性,,DOE Design of Experiment,實驗,設計法,,QCC Quality Control Circle,品,管圈,(,品質改善小組,),,COQ Cost of Quality,品質成本,,英文簡稱 英 文 全 稱 中文解釋,,PCBA Inspection Instruction PCBA,檢驗指導書,,,Production Inspection Instruction,生產檢驗指導書,,,OQA Inspection Procedure OQA,檢驗程序,,,Critical Parts List,主要零件清單,,,Bar Code Control List,條碼控制清單,,,Test Bug List,測試不良清單,,,Test Equipment List,測試設備清單,,,R&D Design Test Report R&D,設計測試報告,,,P4 Reliability Test Report P4,可靠度測試報告,,,Trouble Shooting Guide,引導如何解決問題,,,(,手冊與說明書,),,英文簡稱 英 文 全 稱 中文解釋,,,,Assembly Drawing,裝配圖,,,Preliminary BOM,預備,BOM,,Preliminary Schematics,初步圖紙,,,Safety Checklist,安規查檢表,,,Engineering Version,工程版本,,,IC Master IC,主導裝置,,,,,Pick Up,光學頭,,,Spindle Motor,主軸馬達,,,Sled Motor,傳動馬達,,,Tray Motor,托盤馬達,,,Audio Cable,,音頻線,,常见的简称,英文简称,:  ACF,英文全称,:  Anisotropic Conductive Film,中文全称,:,各向异性导电薄膜,英文简称,:  CCD,英文全称,:  Charge Coupled Device,中文全称,:,电荷耦合装置,英文简称,:  CCL,英文全称,:  Copper Clad Laminate,中文全称,:,覆铜板 英文简称,:  CMOS,英文全称,:  Complementary Metal Oxide Semiconductor,中文全称,:,互补氧化金属半导体,,常见的简称,英文简称,:  COB,英文全称,:  Chip On Board,中文全称,:,通过邦定将,IC,裸片固定于印刷线路板上 英文简称,:  COG,英文全称,:  Chip On Glass,中文全称,:,将芯片固定于玻璃上 英文简称,:  COF,英文全称,:  Chip On FPC,中文全称,:,将,IC,固定于柔性线路板上 英文简称,:  CPU,英文全称,:  Center Processor Unit,中文全称,:,中央处理器,,常见的简称,英文简称,:  DOC,英文全称,:  Disk on Chip,中文全称,:,芯片磁盘 英文简称,:  EL,英文全称,:  Electro Luminescence,中文全称,:,电致发光 英文简称,:  EPROM,英文全称,:  Erasable Programmable Read-Only Memory,中文全称,:,紫外擦除只读存储器,英文简称,:,FPC,英文全称,:,Flexible Printed Circuit,,中文全称,:,柔性线路板,,常见的简称,英文简称,:  GAL,英文全称,:  Generic Array Logic,中文全称,:,通用阵列逻辑 英文简称,:  IC,英文全称,:  Integrate Circuit,中文全称,:,集成电路 英文简称,:  LCD,英文全称,:  Liquid Crystal Display,中文全称,:,液晶显示器 英文简称,:  LCM,英文全称,:  Liquid Crystal Module,中文全称,:,液晶模块,,,常见的简称,英文简称,:  LED,英文全称,:  Light Emitting Diode,中文全称,:,发光二极管 英文简称,:  PAL,英文全称,:  Programmable Array Logic,中文全称,:,可编程阵列逻辑 英文简称,:  PCB,英文全称,:  Printed Circuit Board,中文全称,:,印刷线路板 英文简称,:,PDP,英文全称,:  Plasma Display Panel,中文全称,:,等离子显示屏,,,常见的简称,英文简称,:  PLD,英文全称,:,Programable,Logic Device,中文全称,:,可编程逻辑器件 英文简称,:  PLED,英文全称,:  Polymer Light-Emitting Diode,中文全称,:,高分子发光二极管 英文简称,:  QA,英文全称,:  QUALITY ASSURANCE,中文全称,:,品质保证 英文简称,:  QC,英文全称,:  QUALITY CONTROL,中文全称,:,品质控制,,常见的简称,英文简称,:,RAM,英文全称,:  Random Access Memory,中文全称,:,随机存取存储器 英文简称,:,ROM,英文全称,:  Read Only Memory,中文全称,:,只读存储器 英文简称,:,SGS,英文全称,:,Societe,,Generale,de Surveillance S.A.,中文全称,:,通用公证行 英文简称,:,SMD,英文全称,:  Surface Mount Device,中文全称,:,表面贴片元器件,,常见的简称,英文简称,:,SMT,英文全称,:,Surface Mount Technology,,中文全称,:,表面贴片技术 英文简称,:  TAB,英文全称,:  Tape,Aotomated,Bonding,中文全称,:,各向异性导电胶连接方式 英文简称,:  TCP,英文全称,:  Tape Carrier Package,中文全称,:,柔性线路板 英文简称,:  TTL,英文全称,:,Transister-Transister-Logic,,中文全称,:,晶体管,-,晶体管逻辑电路,,,,。