jesd22-a113-e.pdf

JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22A113E (Revision of JESD22A113D, August 2003) MARCH 2006 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or www.jedec.org Published by ©JEDEC Solid State Technology Association 2006 2500 Wilson Boulevard Arlington, VA 22201-3834 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Please refer to the current Catalog of JEDEC Engineering Standards and Publications online at http://www.jedec.org/Catalog/catalog.cfm Printed in the U.S.A. All rights reserved PLEASE! DON’T VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: JEDEC Solid State Technology Association 2500 Wilson Boulevard Arlington, Virginia 22201-3834 or call (703) 907-7559 JEDEC Standard No. 22A113E -i- Foreword This document provides an industry standard test method for preconditioning components that is representative of a typical industry multiple solder reflow operation. Introduction The typical use of surface mount devices (SMD) involves subjecting the SMDs to elevated temperatures during board assembly, which combined with moisture in the package can induce internal package damage that could be a reliability concern. Preconditioning of SMD packages is used to simulate the effects of board assembly on moisturized packages, prior to reliability testing. This allows reliability testing at the component level on as shippable products with a board assembly simulation. During preconditioning, test samples are subjected to temperature cycling (optional), dry bake, moisture soaking, solder reflow simulation, flux, rinse, dry, and electrical test before reliability testing. JEDEC Standard No. 22A113E -ii- JEDEC Standard No. 22A113E Page 1 Test Method A113E (Revision of A113D) TEST METHOD A113E PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING (From JEDEC Board Ballot JCB-06-21, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test methodsfor Packaged Devices.) 1 Scope This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow). NOTE Correlation of moisture-induced stress sensitivity (per J-STD-020 and JESD22-A113) and actual reflow conditions used are dependent upon identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore, it is recommended that the package temperature at the top center of package be determined during assembly board reflow profile setup, to ensure that it does not exceed the temperature at which the components are evaluated, based on package thickness and volume as stated in IPC/JEDEC J-STD。