UL 796 印刷线路板标准.doc

Tests for UL746E LaminatesTestApplicable StandardBond Strength (BS) for PWBs印制板镀层覆着力测试UL746EVertical Burning (V)垂直燃烧UL94Vertical Burning (V) after Thermal Shock热冲击后垂直燃烧UL94Vertical Burning for Thin Material (VTM)UL94Flexural Strength (FS) 挠曲强度UL746AHigh-Current Arc Ignition (HAI) 高电流电弧引燃UL746AHot Wire Ignition (HWI) 热线圈引燃UL746AHigh-Voltage Arc-Tracking-Rate (HVTR) 高电压电弧起痕速率UL746AHigh-Voltage Arc Resistance (HVAR)高电压耐电弧性UL746ADielectric Strength (DS)绝缘强度UL746AHigh Voltage, Low Current, Dry Arc Resistance (D495)高电压低电流耐电弧性UL746AComparative Tracking Index (CTI) 相对起痕指数UL746AVolume Resistivity (VS)/Surface Resistivity (SR)表面体积电阻率系数UL746ALong-Term Thermal Aging长周期热老化UL746BCold Bend冷弯UL746ERepeated Flexing频繁的弯曲UL746EFlexibility挠性UL746ECoverlay Lamination层压板UL746EConformal Coatings涂层UL746E Tests for UL796 Rigid Printed Wiring Boards (PWBs)TestApplicable StandardBond Strength/Delamination印制板镀层覆着力测试UL796Plating Adhesion镀层附着性测试UL796Conductive Paste AdhesionUL796Dielectric Material Evaluations:- Thermal Cycling热循环UL796- Long-Term Thermal Aging长期热老化UL796Short-Term Evaluations:短期评估- High-Current Arc Ignition (HAI)UL746A- Hot Wire Ignition (HWI)UL746A- Comparative Tracking Index (CTI)UL746A- FlammabilityUL94Conductor Adhesion:- Cu Foil TypeUL796- Paste TypeUL796Long-Term Thermal AgingUL746BFlammabilityUL94 Tests for UL796/UL796F Flexible PWBsTestApplicable StandardBond Strength/DelaminationUL796/UL796FConductive Paste AdhesionUL796/UL796FDielectric Material Evaluations:- Thermal CyclingUL796/UL796F- Long-Term Thermal AgingUL796/UL796FShort-Term Evaluations:- High-Current Arc Ignition (HAI)UL746A- Hot Wire Ignition (HWI)UL746A- Comparative Tracking Index (CTI)UL746A- FlammabilityUL94Conductor Adhesion:- Cu Foil TypeUL796/UL796F- Paste TypeUL796/UL796FLong-Term Thermal AgingUL746BFlammabilityUL94Ambient BendUL796/UL796FCold BendUL796/UL796FRepeated FlexingUL796/UL796FCoverlay LaminationUL796/UL796FFlexible PWB and Stiffener CombinationUL796/UL796Fhttp://www.chemitox.co.jp/eng/pwb.htmlUL 796 印刷线路板标准UL 796 所涉及的产品范围:Rigid Printed-Wiring Board: 硬板Flexible Printed-wiring Board :柔性板这两种板都只能作为零部件使用在电子电器产品中,并在使用时随电子电器产品作进一步的评估 相关标准: UL 94 燃烧测试标准 UL 746E 印刷线路板基材认证标准 UL 746F 柔性印刷线路板材认证标准产品目录(CCN):是UL对一类产品所赋予的代码，通常由四个字母+数字（2,3, 7,8,9）组成。

ZPMV2:硬板; ZPMV3:分包方或单制程认证 ZPXK2: 柔性板 QMTS2；覆铜板（基板） QMJU2：阻焊油（绿油）总结(口诀速记法)一标二制三料四表七量一标：标识二制：单层板制程和多层板制程；三料：基材，阻焊油，PP四表：基本技术参数表，银导体表，基材供应商对应表，阻焊油供应商对应表七量：铜厚，最小线宽，最小边线宽，最小板材厚度，最大温度，最大压力，最长时间专业术语（Glossary）Base Material基材：一种绝缘体，由有机或者无机的材料组成，是导体材料的载体Copper clad laminate(ccl):覆铜箔层压板简称覆铜板，是制造线路板的核心材料主要功能：导电，绝缘，支撑‘基材ANSI等级与对应的材料组成表（一）ANSI/UL Type Resin树脂Reinforcement Material XPC Phenolic酚的、石碳酸 Paper 纸基XXXPC Phenolic Paper C Phenolic Cotton fabric CE Phenolic Cotton fabric 棉布LE Phenolic Cotton fabric G-3 Phenolic Continuous-filament-woven glass fabric G-5 Melamine三聚氰胺Continuous-filament-woven glass fabric G-7 Silicone 硅树脂Continuous-filament-woven glass fabric G-9 Melamine Continuous-filament-woven glass fabric G-10 Epoxy 环氧的Continuous-filament-woven glass fabric连续玻纤有机板 G-11 Epoxy Continuous-filament-woven glass fabric 基材ANSI等级与对应的材料组成表（二）:ANSI/UL Type Resin树脂Reinforcement Material FR-1 Phenolic Paper FR-2 Phenolic Paper FR-3 Epoxy环氧的 Paper FR-4 Epoxy Continuous-filament-woven glass fabric FR-5 Epoxy Continuous-filament-woven glass fabric CEM-1 Epoxy Continuous-filament-woven glass fabric surfaces, cellulose paper core CEM-3 Epoxy Continuous-filament-woven glass fabric surfaces, nonwoven glass core GPO-2 Polyester聚酯Random-laid material of glass fibers GPO-3 Polyester Random-laid material of glass fibers FR-6 Polyester Random-laid material of glass fibers GPY Polyimide Continuous-filament-woven glass fabric 基材最小厚度与ANSI对应表Singlelayer单层板：通常指只有一层绝缘层的电路板，其又可分为单面覆铜（SS）和双面覆铜（DS）的PWBMultilayer：多层板：指有三层以上线路的P W B，电路板工厂从基材供应商处购得基材（Laminate）和半固化片（Prepreg），自己完成内层，压合，与外层的制作。

Mass Laminated PWB:预制多层板：指的是电路板工厂直接从基材供应商处购得已经做好内层线路的材料（此类基材需要被UL 认证为预制多层基材 Mass Lamination），自己只要进行外层加工的一类PWBBuild-up thickness:压合厚度：各种材料厚度的总和，除非另外的说明，压合厚度是不包括内层，外层铜箔厚度的总厚度Immersion silver:沉银：由很薄的（小于0.55微米）接近纯银的涂层组成纯银通常由置换产生，可能会含有少量的沉积的有机物，沉银不需要做银移测试Edge conductor:边缘导体-导体边缘与板边的距离在0.4mm的范围内，而边缘导体的最小线宽其要求需在UL文件的TableI查找Midboard conductor:中部导体：边缘距板边大于0.4mm的倒替区别与边缘导体Maximum area dimeter：最大裸圆直径：MAD，指没有穿孔的连续的最大导体区域内接圆直径Minimum copper thickness:最小铜厚：导线或导板的最小铜厚一般以盎司（OZ）或微米（Mic）为单位，其转换关系为：1OZ=34微米，通常在 UL文件的Table A里可以查到相关数据。

Maximum operation temperature最高工作温度：简称MOT，在连续作业的情况下，用在成品上的线路板所能承受的最高温度而最高工作温度其要求需在UL文件表Table I或Table IA中查找注意：对于只有阻燃等级认证的线路板，。