电路板中英文专业术语词汇(A.docx

电路板专业词 汇（ A－M）Abietic Acid 松脂酸.Abrasion Resistance 耐磨性.Abrasives 磨料,刷材.ABS树脂.Absorption 吸收(入).Ac Impedance 交流阻抗.Accelerated Test(Aging) 加速老化(试验). Acceleration 速化反应.Accelerator 加速剂,速化剂. Acceptability,Acceptance 允收性,允收.Access Hole 露出孔,穿露孔.Accuracy 准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation 活化.Activator 活化剂.Active Carbon 活性炭.Active Parts(Devices)主动零件.Acutance 解像锐利度.Addition Agent 添加剂.Additive Process 加成法.Adhesion 附着力.Adhesion Promotor 附着力促进剂.Adhesive 胶类或接着剂.Admittance 导纳(阻抗的倒数).Aerosol 喷雾剂,气熔胶,气悬体.Aging 老化.Air Inclusion 气泡夹杂.Air Knife 风刀.Algorithm 算法.Aliphatic Solvent 脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp 环境温度.Amorphous 无定形,非晶形.Amp-Hour 安培小时.Analog Circuit/Analog Signal 模拟电路/模拟讯号.Anchoring Spurs 着力爪.Angle of Contack 接触角.Angle of Attack 攻角.Anion 阴离子.Anisotropic 异向性,单向的.Anneal 韧化(退火).Annular Ring 孔环.Anode 阳极.Anode Sludge 阳极泥.Anodizing 阳极化.ANSI美国标准协会.Anti-Foaming Agent 消泡剂.Anti-pit Agent 抗凹剂.AOI 自动光学检验.Apertures 开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level )允收品质水准.Aramid Fiber 聚醯胺纤维.Arc Resistance 耐电弧性.Array 排列.Artwork 底片.ASIC特定用途绩体电路器.Aspect Ratio 纵横比.Assembly 组装装配.A-stage A 阶段.ATE自动电测设备•Attenuation 讯号衰减.Autoclave 压力锅.Axial-lead 轴心引脚.Azeotrope 共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper 反锥斜角.Backpanels, Backplanes 支撑板.Back-up 垫板.Balanced Transmission Lines 平衡式传输线.Ball Grid Array球脚数组(封装).Bandability 弯曲性.Banking Agent 护岸剂.Bare Chip Assembly 裸体芯片组装.Barrel 孔壁,滚镀.Base Material 基材.Basic Grid基本方格.Batch 批.Baume波美度(凡液体比重比水重则Be=145-(145一Sp.Gr)凡液体比重比水轻则Be=140一(Sp.Gr-130)*Sp.Gr为比重即同体绩物质对"纯水"1g/cm的比值).Beam lead 光芒式的平行密集引脚. Bed-of-Nail Testing 针床测试.Bellows Conact 弹片式接触.Beta Ray Backscatter 贝他射线反弹散射. Bevelling 切斜边.Bias 斜张纲布,斜纤法.Bi-Level Stencil] 双阶式钢板.Binder 粘结剂.Bits 头（Drill Bits）.Black Oxide 黑氧化层.Blanking 冲空断开.Bleack 漂洗.Bleeding 溢流.Blind Via Hole 肓通孔.Blister 局部性分层或起泡.Block Diagram 电路系统块图 .Blockout 封纲.Blotting 干印.Blotting Paper 吸水纸.Blow Hole 吹孔.Blue Plaque 蓝纹（锡面钝化层）.Blur Edge （Circle）模糊边带（圈）.Bomb Sight 弹标.Bond Strength 结合强度.Bondability 结合性.Bonding Layer 结合层接着层.Bonding Sheet（Layer）接合片.Bonding Wire 结合线.Bow, Bowing 板弯.Braid 编线.Brazing 硬焊（用含银的铜锌合金焊条）. 在425°C~870°C下进行熔接的方式）.Break Point 显像点.Break-away Panel 可断开板.Breakdown Voltage 崩溃电压.Break-out 破出.Bridging 搭桥.Bright Dip 光泽浸渍处理.Brightener 光泽剂.Brown Oxide 棕氧化.Brush Plating 刷镀.B-stageB 阶段.Build Up Process 增层法制程.Build-up 堆积.Bulge 鼓起.Bump 突块.Bumping Process 凸块制程.Buoyancy 浮力.Buried Via Hole 埋导孔.Burn-in 高温加速老化试验.Burning 烧焦.Burr 毛头.Bus Bar 汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4 芯片焊接.Cable 电缆.CAD 计算机辅助设计.Calendered Fabric 轧平式纲布.Cap Lamination 帽式压合法.Capacitance 电容.Capacitive Coupling 电容耦合.Capillary Action 毛细作用.Carbide 碳化物.Carbon Arc Lamp 碳弧灯.Carbon Treatment, Active 活化炭处理.Card 卡板.Card Cages/Card Racks 电路板构装箱. Carlson Pin 卡氏定位稍.Carrier 载体.Cartridge 滤心.Castallation 堡型绩体电路器.Catalyzed Board, Catalyzed Substrate 催化板材. Catalyzing 催化.Cathode 阴极.Cation 阴向离子, 阳离子.Caul Plate 隔板.Cavitation 空泡化 半真空.Center-to-Center Spacing 中心间距.Ceramics 陶瓷.Cermet 陶金粉.Certificate 证明书.CFC 氟氢碳化物.Chamfer 倒角.Characteristic Impedance 特性阻抗.Chase 纲框.Check List 检查清单.Chelate 螯合.Chemical Milling 化学研磨.Chemical Resistance 抗化性.Chemisorption 化学吸附.Chip 芯片(粒).Chip Interconnection 芯片互连.Chip on Board 芯片粘着板.Chip On Glass 晶玻接装(COG).Chisel 钻针的尖部.Chlorinated Solvent 含氯溶剂,氯化溶剂.Circumferential Separation 环状断孔.Clad/Cladding 披覆.Clean Room 无尘室.Cleanliness 清洁度.Clearance 余地,余环.Clinched Lead Terminal 紧箝式引脚.Clinched-wire Through Connection 通孔弯线连接法 .Clip Terminal 绕线端接.Coat, Coating 皮膜表层.Coaxial Cable 同轴缆线.Coefficient of Thermal Expansion 热膨胀系数.Co-Firing 共绕.Cold Flow 冷流.Cold Solder Joint 冷焊点.Collimated Light 平行光.Colloid 胶体.Columnar Structure 柱状组织.Comb Pattern 梳型电路.Complex Ion 错离子.Component Hole 零件孔.Component Orientation 零件方向.Component Side 组件面.Composites,(CEM-1,CEM-3)复合板材.Condensation Soldering 凝热焊接,液化放热焊接.Conditioning 整孔.Conductance 导电.Conductive Salt 导电盐.Conductivity 导电度.Conductor Spacing 导体间距.Conformal Coating 贴护层.Conformity 吻合性, 服贴性.Connector 连接器.Contact Angle 接触角.Contact Area 接触区.Contact Resistance 接触电阻.Continuity 连通性.Contract Service 协力厂,分包厂.Controlled Depth Drilling 定深钻孔.Conversion Coating 转化皮膜.Coplanarity 共面性.Copolymer 共聚物.Copper Foil 铜皮.Copper Mirror Test 铜镜试验.Copper Paste 铜膏.Copper-Invar-Copper (CIC) 综合夹心板. Core Material 内层板材,核材.Corner Crack 通孔断角.Corner Mark 板角标记.Counterboring 方型扩孔.Countersinking 锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon 板边试样.Coverlay/Covercoat 表护层.Crack 裂痕.Crazing 白斑.Crease 皱折.Creep 潜变.Crossection Area 截面积.Crosshatch Testing 十字割痕试验.Crosshat。