电感国际测试规范.doc

RELIABILITY TEST CONDITIONSWIRE WOUND CHIP INDUCTORS TYPEFOR SMD322522/453232 / SMTSDR322520/453226 / SMDCHGR0603/0805/1008/1210 / SMDFSR1008 / SMTSItem (项目)Required Characteristics (要求)Test Method/Condition (测试方法)High temperature Storage test Reference documents:MIL-STD-202G Method 108A高温储存试验 1.No case deformation or change in appearance.2.ΔL/L≦10%3.ΔQ/Q≦30%4.ΔDCR/DCR≦10%1.无明显的外观缺陷2.感值变化不超过10%3.质量因子变化不超过30% 4.直流电阻变化不超过10% Temperature: 85±2℃ Time : 96±2 hoursTested not less than 1 hour, nor more than 2 hours at room temperature. 温度: 85±2℃,时间: 96±2,小时样品在室温下放置1小时,不 超2小时间必须测试. Low temperature Storage testReferencedocuments:IEC 68-2-1A 6.1 6.2低温储存试验 1.No case deformation or change in appearance.2.ΔL/L≦10%3.ΔQ/Q≦30%4.ΔDCR/DCR≦10%1.无明显的外观缺陷2.感值变化不超过10%3.质量因子变化不超过30% 4.直流电阻变化不超过10% Temperature: -25±2℃ Time : 96±2 hours Tested not less than 1 hour, nor more than 2 hours at room temperature. 温度: -25±2℃,时间:96±2,小时样品在室温下放置1小时,不超2小时间必须测试. Humidity test Reference documents: MIL-STD-202G Method 103B 湿度测试 1.No case deformation or change in appearance. 2.ΔL/L≦10% 3.ΔQ/Q≦30% 4.ΔDCR/DCR≦10% 1.无明显的外观缺陷2.感值变化不超过10% 3.质量因子变化不超过30% 4.直流电阻变化不超过10% 1. Dry oven at a temperature of 40° ±5°Cfor 24 hours.2. Measurements At the end of this period 3. Exposure:Temperature: 40±2℃ , Humidity: 93±3%RH Time : 96±2 hours 4. Tested while the specimens are still in the chamber 5. Tested not less than 1 hour, nor morethan 2 hours at room temperature. 1.样品必须先在40° ±5°条件下干燥24小时2.干燥后测试3.暴露: 温度:40±2℃ , 湿度: 93±3%RH 时间 :96±2 hours 4.暴露结束后,在试验箱中进行测试. 5.样品在室温下放置1小时,不超2小时间必须测试.Thermal shock test Reference documents:MIL-STD-202G Method 107G热冲击测试 1.No case deformation or change in appearance.2.ΔL/L≦10% 3.ΔQ/Q≦30% 4.ΔDCR/DCR≦10%For T: weight≦28g : 15Min; 28g≦weight≦136g : 30Min1.无明显的外观缺陷2.感值变化小于10% 3.质量因子变化小于30% 4.直流电阻变化小于10% First -40℃forT time, next +125℃T time as 1 cycle. Go through 20 cycles. 从-40℃作用T分钟,然后温度冲击到125℃作用T分钟, 作为一个循环,共作用20次. Solderability testReference documents:MIL-STD-202G Method 208HIPC J-STD-002B可焊性测试Terminals area must have 95% min.Solder coverage端子必须有95%以上着锡· Dip pads in flux then dip in solder pot at 245±5°C for 5 second.· Soler: Sn(93.5)/Ag(3.5)· Flux: rosin flux· 端子侵入着焊剂，然后侵入245±5°C 锡炉中5秒 · 焊料 :Sn(93.5)/Ag(3.5) · 助焊剂: 松香助焊剂 Heat endurance of Reflow solderingReference documents:IPC J-STD-020B· No case deformation or change in appearance. · ΔL/L≦10% · ΔQ/Q≦30% · ΔDCR/DCR≦10%· 无明显的外观缺陷 · 感值变化不超过10% · Refer to the next page reflow curve Gothrough 3 times · The peak temperature : 245±5℃· 参照下页回流焊曲线过三次 · 峰值温度为: 245±5℃ 过再流焊测试· 质量因不变化不超过30% · 直流电阻变化不超过10% Vibration testReference documents:MIL-STD-202G Method 201A振动测试1.No case deformation or change in appearance. 2.ΔL/L≦10% 3.ΔQ/Q≦30% 4.ΔDCR/DCR≦10% 1.无明显的外观缺陷2.感值变化不超过10% 3.质量因子变化不超过30% 4.直流电阻变化不超过10% Apply frequency 10~55Hz. 0.75mmamplitude in each of perpendicular direction for 2 hours.(total 6 hours)用10~55Hz 振动频率0.75mm振幅沿X,Y,Z方向各振动2小时.(共6小时)Drop testReference documents:MIL-STD-202G Method 203C落下试验1.No case deformation or change in appearance.2.ΔL/L≦10% 3.ΔQ/Q≦30% 4.ΔDCR/DCR≦10%For T: weight≦28g : 15Min; 28g≦weight≦136g : 30Min1.无明显的外观缺陷2.感值变化小于10% 3.质量因子变化小于30% 4.直流电阻变化小于10% Packaged & Drop down from1m with 981m/s2(100G) attitude In 1 angle 1 ridges & 2 surfaces orientations.将产品包装后从1米高度自然落下至试验板上Terminal strength push testReference documents:JIS C 5321:1997端子强度试验Pulling test:DEFINE: A: sectional area of terminalA≦8 (Sq M) force≧5N time:30sec8(Sq M)