南亚PNHF材料介绍课件.ppt

Nan Ya CCLCCL Technical Dept., Electronic Materials Div.Nan Ya Plastics CorporationTAIWANNan Ya MultilayerNan Ya MultilayerPCB LaminatesPCB Laminates南亚PNHF材料介绍Nan Ya CCLEnvironmental ProtectionSignal Speed&IntegrityReliabilitySmaller Form FactorPCB TechTrendsBuild up/HDIPhosphorous FreeImpedance ControlNarrower LineSpacingFlexibleEmbedded PassivesHigh Layer CountLow Dk/Low LossHi TgInsulationLow CTEHalogen FreeLow Water AbsorptionCAF-Resistant產品開發與應用產品開發與應用產品開發與應用產品開發與應用Lead Free Compatible•NP-200 (BT Grade) • NP-180F (Hi Tg & Low CTE)• NP-175(F)• NP-155(F)• NP-170• NP-150• NP-140M(Low Tg/Hi Td)• Anti-CAF Materials• High CTI FR4• NPG NPGN-150NPG-170NPGN-170• NPX-200 (For Substrates)• Bendable CCL• Laser Prepreg• RCC•2 mil & 3 mil Cores•Ultra thin glass yarn1037•Embedded Capacitance•NPLDII & Low Dk glass南亚PNHF材料介绍Nan Ya CCL南亞產品列表南亞產品列表TG℃℃ Tg by DSC Suitable for Lead Free Optional for Lead Free ◎NPG(Halogen Free)NPG-200NPG-170NP-LDII NP-175/FNP-170NP-155/FNP-150FR-4 D/S200NPG-180 High Tg(H.F) high layer count MLB IC SubstrateNP-200BT Laminate IC Substrates BT Laminate (H.F) IC Substrate NP-180/FFR-5 Gradehigh layer count MLB IC SubstrateRCCFR-4 Gradehigh layer Count MLB High Tg (H.F) high layer count MLBHigh performance FR-4 Special applicationFR-4-86 UVFR-4-98 CTI 600NPGNPGN-150 Halogen Free FR-4NP-140MNP-140FR-4 Tetra-functional for MLB180CEM-3CEM-1CEM-3-86/CEM-3-01 Halogen freeCEM-1-87/ CEM-1-97 CTI600Laser PP Laser drillable prepreg for HDI175150140135130Low Dk/DfHigh frequency/low loss Resin coated copper for HDI180180O O O O O O◎◎◎◎南亚PNHF材料介绍Nan Ya CCL印刷電路板印刷電路板(PCB) 應用應用NP-180RCCLaser P.P移动移动HDI产品产品CEM-1CEM-3电源供应器，监视电源供应器，监视器，电视游戏器，电视游戏NP-140MNP-140個人電腦個人電腦, 筆記本筆記本電腦電腦,個人電腦外個人電腦外設設FR-4 個人電腦個人電腦, 筆記本筆記本電腦電腦 ,個人電腦外個人電腦外設設NP-155(F)NP-150個人電腦個人電腦,笔记本笔记本电脑电脑 PCMCIAPCMCIA卡卡NPGNNPG個人電腦個人電腦& 筆記本筆記本電腦磁盤驅動器電腦磁盤驅動器NPG-180BGA, CSP, 網絡服務器網絡服務器 NP-200BGA, CSPBGA, CSPNPG-200NP-LD基站基站NP-175(F)NP-170通信服務器通信服務器BGA, CSP, 汽車網絡服務器汽車網絡服務器南亚PNHF材料介绍Nan Ya CCLØ“ “無鉛無鉛無鉛無鉛” ”對元件組裝影響對元件組裝影響對元件組裝影響對元件組裝影響●無鉛組裝之焊錫材料熔點更高無鉛組裝之焊錫材料熔點更高●●回流焊過程有更高的溫度曲線回流焊過程有更高的溫度曲線焊錫類型焊錫類型熔點熔點(℃)(℃)I.R I.R 最高溫度最高溫度（（℃℃) )高溫高溫. .Sn-Ag-CuSn-Ag-Cu(96.5 3 0.3)(96.5 3 0.3)217217～～220220245245～～260260較高溫度較高溫度. .Sn-Ag-Cu-Bi(in)Sn-Ag-Cu-Bi(in)210210～～220220235235～～245245一般一般Pb-SnPb-Sn(33 67)(33 67)183183225225～～230230南亚PNHF材料介绍Nan Ya CCL Soak time Ramp-up rate ℃ Lead free reflow (SnAgCu) Tin/Lead(63/37) reflow 迴流焊溫度曲線比較迴流焊溫度曲線比較T:30-44℃T:20-30℃Peak TempTime above liquidus(TAL)500100150200250Melting point     LF Melting point南亚PNHF材料介绍Nan Ya CCL高耐熱性高耐熱性(Br-樹脂樹脂)覆銅板產品系列覆銅板產品系列NP-150NP-200NP-180TG(℃)NP-140200180175150140BT LaminateFR-5 GradeMedium Tg FR-4 FR-4NP-180(F) NP-175          NP-175F NP-155          NP-155FNP-140 Modify(New)NP-140 Modify(New)High Thermal Stability MaterialNP-170High Tg FR-4南亚PNHF材料介绍Nan Ya CCL NP-140NP170NP140MNP-155FNP-175FThickness (mm)1.61.61,61.61.6DSC Tg135℃171 ℃135 ℃155℃170℃Peel Strength (1oz)12.510.511.59.59.51/2hr PCT moisture0.226%0.190.2100.15%0.147%1/2hr PCT+288℃solder dipping3’30”4’30”10”10’10’Z-axis α1/ ppm/℃67.1606548.349.5Z-axis α2/ ppm/℃288.0285289256.5259.7CTE 50-260℃ %4.33.74.33.33.1T-288 delamination 2.07 min2~5>5min> 30 min> 30 minT-260 delamination25.03 min25~30>30min＞＞60 min＞＞60 minTGA  Td (on set)309.2℃311 ℃323.5 ℃357℃359℃TGA 5% Wt Loss311.3℃312.2 ℃325.9 ℃360℃361℃FR-4, NP-155F,NP-175F 特性比對特性比對南亚PNHF材料介绍Nan Ya CCLIPC 規范規范 vs Nan Ya 材料材料南亚PNHF材料介绍Nan Ya CCLItemFR4NPGNPGN-150NPG-170NPGN-170NPG-180NPG-200Resin systemBr. EpoxyHalogen FreeHalogen FreeHalogen FreeHalogen FreeHalogen FreeHalogen FreeCuring agentDicyDicy Non DicyDicyNon DicyNon DicyNon DicyTg (℃,DSC)140150145(TMA)170170190(DMA)205(DMA)CTE (%, 50~250℃)4.12.42.42.32.42.22.0T-260 (min)25>60>60>60>60>60>60T-288 (min)2>5>20>5>20>40>40Td (℃,TGA)310350360359360367370Dk (@1GHz)4.504.604.504.604.534.824.40Df (@1GHz)0.0160.0120.0130.0120.0130.0150.013Rigid construction: 4 ply 7628NPG: “G” for Green (HF) Materials南亚各系列无卤材料特性南亚各系列无卤材料特性比較比較南亚PNHF材料介绍Nan Ya CCLHATSHATS冷热冲击测试结果冷热冲击测试结果冷热冲击测试结果冷热冲击测试结果MaterialA conditionPre-condition245℃ reflowx6Pre-condition 260℃ reflowx6一般材料一般材料162-247150-266142-227Mid-Tg PN +填充材填充材>1000>1000800-900Hi-TgPN +填充材填充材>1000>1000>1000无卤材料无卤材料>1000>1000>1000Test Condition:-40-145 ℃/1000 cyclesSample:12-layer test vehicle南亚PNHF材料介绍Nan Ya CCL热膨胀特性热膨胀特性热膨胀特性热膨胀特性Expansion, PPM/℃一般材料一般材料PN FR4+填充材填充材Hi Tg无卤材料无卤材料X-CTEY-CTE15~1815~1813~1513~1511~1311~13Z-CTE, Before TgZ-CTE, After Tg582874526035.3210南亚PNHF材料介绍Nan Ya CCL线路板加工之影响一般材料一般材料无卤材料无卤材料钻孔钻孔2,000钻钻1,500钻钻除渣除渣OK需调整制程条件需调整制程条件黑棕化药水黑棕化药水OK接着力较低接着力较低 压合压合操作空间操作空间較較广广需调整制程条件需调整制程条件印刷线路板加工条件之建议印刷线路板加工条件之建议印刷线路板加工条件之建议印刷线路板加工条件之建议南亚PNHF材料介绍Nan Ya CCL钻孔条件钻孔条件Machine Hole sizSpeedInfeedRTRThkPNL/StsckSchmoll LZ0.30mm160 Kr/min134 IPM437 IPM1.62 ply钻头磨损比较钻头磨损比较1000 hit2000 hit3000 hit Total (48000 hit)NPG 24.46%30.72%36.52%30.56%NPGN-15025.28%27.32%32.93%28.51%      NPG&NPGN-150鑽孔比對測試鑽孔比對測試南亚PNHF材料介绍Nan Ya CCL钻钻孔精度孔精度比較比較NPGNPGN-150Cp/Cpk1.334/0.7851.859/1.204Target ( > 2.0 mil )1325/48098660/481042.75%1.37%南亚PNHF材料介绍Nan Ya CCL钻头磨耗比较钻头磨耗比较新新钻头钻头 FR4PN+填充材填充材无卤材料无卤材料条件条件Rpm:200KIPM:114.2Hits:3500Hole size:10 mil南亚PNHF材料介绍Nan Ya CCLMaterial typesBlack OxideBrown OxideChemical ABCDStandard FR44.933.854.563.57NPG3.233.123.012.74NPGN-1503.693.463.593.12Unit: lb/in无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较南亚PNHF材料介绍Nan Ya CCL無鹵材性能比較表無鹵材性能比較表-CCL南亚PNHF材料介绍Nan Ya CCLNPG(Dicy)NPGN-150(PN)PCBLayer10L14LThicknessmm1.8-2.02.4-2.5DSC-Tg ℃155150.6288 ℃ Solder floating 10”->6 cycles>10 cycles260 ℃ IR Reflow cycles-6-7 cycles>10 cyclesT-260min8.5824.06T-288min2.258.68PCBLayer2+4+23+2+3Thicknessmm1.00.8DSC-Tg ℃156.8150.5260 ℃ IR reflow cycles-10-12>15T-260min25.42‘-T-288min2-5‘>30‘無鹵材性能比較表無鹵材性能比較表-PCB南亚PNHF材料介绍Nan Ya CCL南亞無鹵材市場應用狀況南亞無鹵材市場應用狀況南亚PNHF材料介绍Nan Ya CCL謝謝指教謝謝指教謝謝指教謝謝指教http://南亚PNHF材料介绍。