可靠度测试列表.doc

Reliability Test ListItemTest ConditionTest StandardSystem Reliability TestHigh Relative Humidity Test60℃/90%RH,68 HourGR-63 4.1.2High Temperature Operating60℃,72 HourGR-63 4.1.1High Temperature Power Cycling60℃ for at least 2 hour, then power cycle 200 times, on/off period >60 sec. CustomizedLow temperature Operating-40℃,72 HourGR-63 4.1.1Normal Temperature Operating25℃/60%RH,1000 HourCustomizedTemperature Cycling-40℃ to 60℃,2 Hour dwell, 20℃/min ramp,1 Hour dwell,50 cycleGR-63 4.1.1Vibration Test(Middle frequency/random)5-500Hz,0.005g2/Hz,3 axis,90 min/axis,～1.6GrmsGR-63 4.4.4Vibration Test(Shock)50G,half-sine,11ms duration,3 times,3 orthogonal axis, both directions,18 shocks totalGR-63 4.4.4Surge TestStandard 0.5μs-100KHz ring wave,6KV IEEE C62.41-1991Standard 1.2/50μs-8/20μs combination wave,6KVOptical Component Reliability TestVibration20-2000Hz,20 Gpeak/1.5mm,1mm,X,Y,Z Axe,4min/cycle,4 cycle/axeMIL-STD-883E Method 2007,GR- 468 4.3.2Temperature Cycling-40℃/10min～+85℃/10min,1000 cycleMIL-STD-883E Method 2007,GR- 468 4.3.2CTH(Cycl.Temp.Humi dity)-10℃/+65℃ with 80%/98%RH,10 cycle,24h/cycleMIL-883 Meth.1004LTS(Low Temp.Storage)-40℃(+/-2℃),2000 hourIEC68-2-1AHTS(High Temp.Storage)+85℃(+/-2℃),2000 hourJESD22-A103-BAcc Aging High Temp.Max storage temperature(+85℃),5000 hour,25PCSGR-468 Sec.4.3.2,@-453 Section 5.18, JESD22-A108-BDamp Heat85℃,85%RH,2000 hourGR-468 Sec.4.3.2ESD HBM(Pin to Pin)±1000VApply(+5) then(-5)-voltage pulses to each pin& GND at each voltage level,±1000V(class 2)GR-468 Sec.5.22,MIL-STD- 883 Method 3015.7(Human Body Model) ESD SDM(Pin to Pin)±1000VApply(+5) then(-5)-voltage pulses to each pin& GND at each voltage level,±1000V(class 2)EOS/ESD-DS5.3- 1993 RSH(Res.To sold.heat)275℃,10s bath,3XJESD22-B106-B6- BThermal Shock△T=100℃,0℃/5min to 100℃/5min,15 cycles,6 cycles/hrMIL-STD-883 Mothod1011,GR- 468 4.3.2Solderability235℃±3℃,1min flux,2s bathJESD22-B102-C。