allegro中常见的drc错误代码意思.docx

DRC 错误代码代码单一字符代码相关对象 说明L Line 走线P Pin 元件脚V Via 贯穿孔K Keep in/out 允许区域/禁止区域C Component 元件层级E Electrical Constraint 电气约束J T-Junction 呈现 T 形的走线I Island Form 被 Pin 或 Via 围成的负片孤铜错误代码前置码说明W Wire 与走线相关的错误D Design 与整个电路板相关的错误M Soldemask 与防焊层相关的错误错误代码后置码说明S Shape/Stub 与走线层的 Shape 或分支相关的错误N Not Allowed 与不允许的设置相关的错误W Width 与宽度相关的错误双字符错误代码BB Bondpad to Bondpad Bondpad 之间的错误BL Bondpad to Line Bondpad 与 Line 之间的错误BS Bondpad to Shape Bondpad 与 Shape 之间的错误Package to Package Package 之间的 Spacing 错误CCSymbol Soldermask to Symbol Soldermask 零件防焊层之间的 Spacing 错误Differential Pair Length Tolerance差分对走线的长度误差过长Differential Pair Primary Max Separation差分对走线的主要距离太大Differential Pair Secondary Max Separation差分对走线的次要距离太大DFDifferential Pair Secondary Max Length差分对走线的次要距离长度过长DI Design Constraint Negative Plane Island负片孤铜的错误Propagation-Delay 走线的长度错误EDRelative-Propagation-Delay 走线的等长错误EL Max Exposed Length 走线在外层（TOP&BOTTOM）的长度过长EP Max Net Parallelism Length-Distance Pair已超过 Net 之间的平行长度ES Max Stub Length 走线的分支过长ET Electrical Topology 走线连接方式的错误EV Max Via Count 已超过走线使用的 VIA 的最大数目Max Crosstalk 已超过 Crosstalk 值EXMax Peak Crosstalk 已超过 Peak Crosstalk 值HH Hold to Hold Spacing 钻孔之间的距离太近Diagonal Wire to Hold Spacing 斜线与钻孔之间的距离太近HWHold to Orthogonal Wire Spacing钻孔与垂直/水平线之间的距离太近IM Impedance Constraint 走线的阻抗值错误JN T Junction Not Allowed 走线呈 T 形的错误Route Keepin to Bondpad Bondpad 在 Keepin 之外Route keepout to Bondpad Bondpad 在 keepout 之内KBVia Keepout to Bondpad Bondpad 在 Via Keepout 之内Package to Place Keepin Spacing元件在 Place Keepin 之外KCPackage to Place Keepout Spacing元件在 Place Keepout 之内Line to Route Keepin Spacing 走线在 Route Keepin 之外KLLine to Route Keepout Spacing 走线在 Route Keepout 之内Shape to Route Keepin SpacingShape 在 Route Keepin 之外KSShape to Route Keepout SpacingShape 在 Route Keepout 之内BBVia to Route Keepin SpacingBBVia 在 Route Keepin 之外BBVia to Route Keepout SpacingBBVia 在 Route Keepout 之内KVBBVia to Via Keepout Spacing BBVia 在 Via Keepout 之内Test Via to Route Keepin SpacingTest Via 在 Route Keepin 之外Test Via to Route Keepout SpacingTest Via 在 Route Keepout之内Test Via to Via Keepout SpacingTest Via 在 Via Keepout 之内Through Via to Route Keepin SpacingThrough Via 在 Route Keepin 之外Through Via to Route Keepout SpacingThrough Via 在 Route Keepout 之内Through Via to Via Keepout SpacingThrough Via 在 Via Keepout之内LB Min Self Crossing Loopback Length无LL Line to Line Spacing 走线之间太近LS Line to Shape Spacing 走线与 Shape 太近Min Line Width 走线的宽度太细LWMin Neck Width 走线变细的宽度太细MA Soldermask Alignment Error PadSoldermask Tolerance 太小MC Pin/Via Soldermask to Symbol SoldermaskPad 与 Symbol Soldermask之间的错误MM Pin/Via Soldermask to Pin/Via SoldermaskPad Soldermask 之间的错误PB Pin to Bondpad Pin 与 Bondpad 之间的错误Line to SMD Pin Spacing 走线与 SMD 元件脚太近Line to Test Pin Spacing 走线与 Test 元件脚太近PLLine to Through Pin Spacing 走线与 Through 元件脚太近SMD Pin to SMD Pin Spacing SMD 元件脚与 SMD 元件脚太近SMD Pin to Test Pin Spacing SMD 元件脚与 Test 元件脚太近Test Pin to Test Pin Spacing Test 元件脚与 Test 元件脚太近Test Pin to Through Pin SpacingTest 元件脚与 Through 元件脚太近Through Pin to SMD Pin SpacingThrough 元件脚与 SMD 元件脚太近PPThrough Pin to Through Pin SpacingThrough 元件脚与 Through元件脚太近Shape to SMD Pin Spacing Shape 与 SMD 元件脚太近Shape to Test Pin Spacing Shape 与 Test 元件脚太近PSThrough Pin to Shape Spacing Through 元件脚与 Shape 太近BBVia to SMD Pin Spacing BBVia 与 SMD 元件脚太近BBVia to Test Pin Spacing BBVia 与 Test 元件脚太近BBVia to Through Pin Spacing BBVia 与 Through 元件脚太近SMD Pin to Test Via Spacing SMD Pin 与 Test Via 太近SMD Pin to Through Via SpacingSMD Pin 与 Through Via 太近Test Pin to Test Via Spacing Test Pin 与 Test Via 太近Test Pin to Through Via SpacingTest Pin 与 Through Via 太近Test Via to Through Pin SpacingTest Via 与 Through Pin 太近PVThrough Pin to Through Via Through Pin 与 Through ViaSpacing 太近RC Package to Hard Room 元件在其他的 Room 之内Min Length Route End Segment at 135Degree无REMin Length Route End Segment at 45/90Degree无135Degree Turn to Adjacent Crossing Distance无 SB90Degree Turn to Adjacent Crossing Distance无Min Length Wire Segment 无SLMin Length Single Segment Wire无SN Allow on Etch Subclass 允许在走线层上SO Segment Orientaion 无BB Bondpad to Bondpad Bondpad 之间的错误SS Shape to Shape Shape 之间的错误TA Max Turn Angle 无VB Via to Bondpad Via 与 Bondpad 之间的错误Max BB Via Stagger Distance 同一段线的 BB Via 之间的距离太长Min BB Via Gap BB Via 之间太近Min BB Via Stagger Distance 同一段线的 BB Via 之间的距离太近VGPad/Pad Direct Connect Pad 在另一个 Pad 之上BB Via to Line Spacing BB Via 与走线太近VLLine to Through Via Spacing 走线与 Through Via 太近Line to Test Via Spacing 走线与 Test Via 太近BB Via to Shape Spacing BB Via 与 Shape 太近Shape to Test Via Spacing Shape 与 Test Via 太近VSShape to Through Via Spacing Shape 与 Through Via 太近BB Via to BB Via Spacing BB Via 之间太近BB Via to Test Via Spacing BB Via 与 Test Via 太近BB Via to Through Via Spacing BB Via 与 Through Via 太近Test Via to Test Via Spacing Test Via 之间太近Test Via to Through Via SpacingTest Via 与 Through Via 太近VVThrough Via to Through Via SpacingThrough Via 之间太近WA Min Bonding Wire Length Bonding Wire 长度太短Min End Segment Length 无Min Length Wire End Segment at。