目视检验规范IPC610文档资料.ppt

目視檢驗規范IPC610IPQC RUI_LI2010/1/201目視檢驗規范標准IPC6101.允收標准2.拒收標准 2 零件本體僅下方有二接觸點的零件(Chip Components/Bottom Only Terminations cont.) – 偏移 (Shift) 允收 (Target Condition)零件黏焊於錫墊中心位置, 沒有任何偏移.  No side overhang. 允收極限 (Acceptable)零件往錫墊寬邊(A)偏移, 但零件 本體寬邊(C) 有75% 以上焊接於 錫墊上.零件本體與電路板錫墊間(G)錫 厚至少0.2 mm. Side overhang (A) is allowed if minimum end joint width (C) requirements are met.Minimum is 75%.Minimum thickness (G) is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance. 拒收 (Nonconforming Defect) 零件往錫墊寬邊(A)偏移, 且零 件本體小於75% 寬邊(C) 焊接 於錫墊上. 零件往錫墊長邊(B)偏移. Side overhang (A) is allowed if minimum end joint width (C) requirements are met. Minimum is 75%.Minimum thickness (G) is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance. 3零件本體有1,3,5面矩形金屬焊接點 (Rectangular End Components-1,3or5 side Termination) – 偏移 (Shift) 允收 (Target Condition)零件金屬部份黏焊於錫墊中 心位置, 沒有任何偏移. 零件 本體錫墊完全沾錫. No side overhang. Side joint length (D) equals component termination length. 允收極限 (Acceptable)零件往錫墊寬邊(A)偏移, 但 零件本體金屬焊墊寬邊(W) 75%以上焊接於電路板錫墊上. End joint width (C) is 75% width of component termination area (W) or 75% width of PB land (P), whichever is less. 拒收 (Nonconforming Defect) 零件往錫墊寬邊(A)偏移, 但零 件本體不足75% 寬邊(C)以上焊 接於電路板錫墊上.零件往錫墊長邊偏移(B).Side overhang (A) causes minimum end joint width (C) requirements not to be met. End overhang (B) is not permitted. 4零件本體有1,3,5面矩形接觸點 (Rectangular End Components-1,3or5 side Termination) – 偏移 (Shift) 允收 (Target Condition)零件黏焊於錫墊中心位置, 沒有任何偏移. 零件本體錫 墊完全沾錫.  No side overhang. 允收極限 (Acceptable)零件往錫墊寬邊偏移, 但零件 之焊接面佔75% 以上. End joint width is 75% width of component termination area or 75% width of PB land , whichever is less. 拒收 (Nonconforming Defect)零件往錫墊長邊偏移.  End overhang is not permitted. 5 圓柱體零件 (Cylindrical End Cap Termination) – 偏移 (Shift) 允收 (Target Condition)零件黏焊於錫墊中心位置, 沒有任何偏移. 吃錫面在圓筒零件直徑(W) 與板上錫墊長(P)之間. No side overhang. End joint width is equal to or greater than the component width (W) or width of the land (P), whichever is less. 允收極限 (Acceptable)零件往錫墊寬邊偏移(A), 側 邊偏移度允收極限為零件直 徑(W)的25% 或錫墊長度(P) 的25%. Side overhang (A) is 25% diameter of component width (W) or land with (P). 拒收 (Nonconforming Defect)零件側邊偏移度(A)超出25%零 件直徑 (W)或錫墊長度(P)的25%.零件往錫墊長邊偏移(B). Side overhang (A) is 25% diameter of component width (W) or land with (P). End overhang is not permitted. 6無導腳零件(Leadless Chip Carriers with Castellated Terminations) – 偏移 (Shift) 允收 (Target Condition)零件未偏移.零件延伸引腳長等於電路板 上錫墊長.零件立於電路板上錫墊中心. No side overhang. Fillet extension equals land width. Fillet height covers terminal. 允收極限 (Acceptable)零件偏移向錫墊寬邊之間(A), 偏移度小於電路板上錫墊面 (W)的25%. Maximum side overhang (A) is 25%W. 拒收 (Nonconforming Defect)零件偏移向錫墊寬邊之間(A), 偏 移度大於電路板上錫墊面(W)的 25%.零件偏移向錫墊長邊之間 (B). Maximum side overhang (A) is 25%W.End overhang (B) is not permitted. 7允收 (Target Condition) 零件腳未偏移. No side overhang. 允收極限 (Acceptable)零件偏移向錫墊寬邊之間(A), 偏移小於電路板上錫墊寬度 (W)的 25% 或偏移小於0.5mm. Side overhang (A) is 25%W or 0.5 mm. 拒收 (Nonconforming Defect)零件偏移向錫墊寬邊之間(A), 偏移大於電路板上錫墊寬度(W) 的 25%或偏移大於0.5mm.不允許任何的零件趾端偏移 如(B). Side overhang (A) is greater than 25%W or 0.5 mm whichever is less.Toe overhang (B) is not specified 平緞腳 (L型) / 鷗翼腳 /圓柱L腳(Flat Ribbon "L" / Gull Wing leads / Round leads) – 偏移 (Shift) 8"I" 腳 (“I” Leads) – 偏移 (Shift) 允收 (Target Condition)零件腳未偏移. No side overhang. 允收極限 (Acceptable)零件偏移向錫墊寬邊之間(A), 偏移大於錫腳寬度 (W) 的25% 仍不允許. 不允許任何的偏移. Overhang(A) exceeds 25% lead width (W). No overhang allowed. 拒收 (Nonconforming Defect)不允許任何的零件趾端偏移 如(B). Toe overhang (B) is not specified. 9範例 (Example) - 平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon "L" / Gull Wing leads / Round leads)允收 (Target Condition)允收極限 (Acceptable)拒收 (Nonconforming Defect)10範例 (Example) - 平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon "L" / Gull Wing leads / Round leads)拒收 (Nonconforming Defect)拒收 (Nonconforming Defect)拒收 (Nonconforming Defect)11範例 (Example) - "J" 腳 / "I" 腳 允收極限 (Acceptable)拒收 (Nonconforming Defect)拒收 (Nonconforming Defect) ë12範例 (Example) 拒收 (Nonconforming Defect)高翹 / LIFTED 13範例 (Example) 高翹 / LIFTEDOKNG14範例 (Example) 拒收 (Nonconforming Defect)折腳 / BENT 缺件 / MISSING 偏移 / SHIFT 15範例 (Example) 拒收 (Nonconforming Defect)破損 / DAMAGE 16範例 (Example) 拒收 (Nonconforming Defect)撞件 / BROKEN 撞件 / BROKEN  17範例 (Example) 允收極限 (Acceptable)偏移 / SHIFT  錫洞 / Solder Hole  18範例 (Example) ASR1 : LED2 反向 / REVERSE 拒收 (Nonconforming Defect) ë缺口端為負極 / Nick side is “ －” 5168 : SW4 反向 / REVERSE Switch數字與PCBA同向 / Number on component same direction with PCBA.1920範例 (Example)  折腳 / PIN BENT 包焊 / Poor Solder拒收 (Nonconforming Defect)21範例 (Example) 拒收 (Nonconforming Defect)NG OK 退PIN 22Travis M/B DIP component cosmetic 1,整体高翘，且最大不可以超过0.3mm2.后邊、前邊緣高翹不可超過0.2mm 整體高翹單邊高翹23Travis M/B DIP component cosmetic 1.1.水平高翘，最大允许限度为水平高翘，最大允许限度为0.3mm. 0.3mm. 2.2.不允许不允许單單边高翘。

边高翘24Travis base sampleRAM RAM 的卡勾不可出现变形等不良的卡勾不可出现变形等不良25Travis M/B DIP component cosmetic 不能出现任何标记,特别是有铅异物不能出现任何标记,特别是有铅异物26Travis M/B DIP component cosmetic JUSB 不可出现气泡和明不可出现气泡和明显擦痕显擦痕 .27 Travis base sampleMicrophone 不能失掉海绵，禁止使用双面胶黏贴脱落海绵28 Travis M/B solder hole JDOCK 不允許單邊高翹29 Travis base sample1.Function Pin 吃锡量不应少于75%.2.固定pin锡量不应少于50%.（以固定住零件为标准）3.折脚 （1）:如果pin 折脚但是有露出，function 測試pass 可以判断为良品 (2) 如果pin脚完全没有露出，则要判断为不良固定固定pinFunction pin30 Travis base samplepin 脚不可刺穿该处Mylar31 Travis base sampleSmart card socket Smart card socket 不可出现大幅度凹陷变形。

不可出现大幅度凹陷变形32 Travis base sampleJSIO , JCRT 等零件不可出现沾锡等不良, PBATT late solder can be accept 33THE END34。