电子组装的ipc标准列表.pdf

IPC-T-50GIPC-T-50GTermsandDefinitionforInterconnectingandPackagingElectronic Circuits电子电路互连与封装的定义和术语IPC-TM-650IPC-TM-650Test Methods Manual试验方法手册IPC/EIAIPC/EIA J-STD-001CJ-STD-001CRequirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求IPC-HDBK-001IPC-HDBK-001Handbook and Guide to Supplement J-STD-001—Includes Amendment1J-STD-001辅助手册及指南及修改说明1IPC-A-610DIPC-A-610DAcceptability of Electronic Assemblies印制板组装件验收条件IPC-HDBK-610IPC-HDBK-610Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to CComparisonIPC-610手册和指南(包括 IPC-A-610B 和 C 的对比)IPC-EA-100-KIPC-EA-100-KElectronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。

IPC/WHMA-A-620IPC/WHMA-A-620Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收IPC/EIAIPC/EIA J-STD-012J-STD-012Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用IPC-SM-784IPC-SM-784Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则IPC/EIAIPC/EIA J-STD-026J-STD-026Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准J-STD-027J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurationsFC（倒装片）和 CSP(芯片级封装)的外形轮廓标准IPC/EIAIPC/EIA J-STD-028J-STD-028Performance Standard for Construction of Flip Chip and Chip ScaleBumps倒装芯片及芯片级凸块结构的性能标准J-STD-013J-STD-013ImplementationofBall GridArray andOther HighDensityTechnology球栅阵列 (BGA)及其它高密度封装技术的应用IPC-7095IPC-7095Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施IPC/EIAIPC/EIA J-STD-032J-STD-032Performance Standard for Ball Grid Array BallsBGA 球形凸点的标准规范IPC-MC-790IPC-MC-790Guidelines for Multichip Module Technology Utilization多芯片组件技术应用导则IPC-M-108IPC-M-108Cleaning Guides and Handbook Manual清洗导则和手册IPC-5701IPC-5701Users Guide for Cleanliness of Unpopulated Printed Boards非密集型印制板清洁应用导则IPC-TP-1113IPC-TP-1113Circuit Board Ionic Cleanliness Measurement: What Does It TellUs?电路板离子洁净度测量：它告诉我们什么？IPC-CH-65AIPC-CH-65AGuidelines for Cleaning of Printed Boards & Assemblies印制板及组装件清洗导则IPC-SC-60AIPC-SC-60APost Solder Solvent Cleaning Handbook锡焊后溶剂清洗手册IPC-SA-61AIPC-SA-61APost Solder Semi-aqueous Cleaning Handbook锡焊后半水溶剂清洗手册IPC-AC-62AIPC-AC-62AAqueous Post Solder Cleaning Handbook锡焊后水溶液清洗手册IPC-TR-476AIPC-TR-476AElectrochemical Migration: Electrically Induced Failures inPrintedCircuit Assemblies电化学迁移：印制电路组件的电气诱发故障IPC-TR-582IPC-TR-582Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids,Fluxes and Pastes Processed in Ambient AirIPC 第3阶段非清洗助焊剂研究IPC-TR-583IPC-TR-583An In-Depth Look At Ionic Cleanliness Testing深入离子洁净度测试IPC-9201IPC-9201Surface Insulation Resistance Handbook表面绝缘电阻手册IPC-TP-104-KIPC-TP-104-KCleaning & Cleanliness Test Program, Phase 3 Water SolubleFluxes,Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分IPC-M-109IPC-M-109Component Handling Manual元件处理手册IPC/JEDECIPC/JEDEC J-STD-020CJ-STD-020CMoisture/ReflowSensitivityClassificationforNonhermeticSolid State Surface Mount Devices非密封固态表面贴装器件湿度／再流焊敏感度分类IPC/JEDECIPC/JEDEC J-STD-033AJ-STD-033AHandling, Packing, Shipping and Use of Moisture/Reflow SensitiveSurface Mount Devices对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用IPC/JEDECIPC/JEDEC J-STD-035J-STD-035Acoustic Microscopy for Non-Hermetic Encapsulated ElectronicComponents非气密封装电子元件用声波显微镜IPC-DRM-18GIPC-DRM-18GComponent Identification Desk Reference Manual零件分类标识手册IPC-DRM-SMT-CIPC-DRM-SMT-CSurface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册IPC-DRM-40EIPC-DRM-40EThrough-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册IPC-DRM-56IPC-DRM-56Wire Preparation & Crimping Desk Reference Manual导线和端子预成形参考手册IPC-DRM-53IPC-DRM-53Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册IPC-M-103IPC-M-103Standards for Surface Mount Assemblies Manual所有 SMT 标准合订本IPC-M-104IPC-M-104Standards for Printed Board Assembly Manual10种常用印制板组装标准合订本IPC-TA-722IPC-TA-722Technology Assessment of Soldering锡焊技术精选手册IPC-TA-723IPC-TA-723Technology Assessment Handbook on Surface Mounting表面安装技术精选手册IPC-TA-724IPC-TA-724Technology Assessment Series on Clean Rooms清洁室技术精选系列IPC-SM-780IPC-SM-780Component Packaging and Interconnecting with Emphasis on SurfaceMounting以表面安装为主的元件封装及互连导则IPC-SM-785IPC-SM-785Guidelines for Accelerated Reliability Testing of Surface MountAttachments表面安装焊接件加速可靠性试验导则IPC-9701IPC-9701Performance Test Methods and Qualification Requirements forSurface Mount Solder Attachments表面安装锡焊件性能试验方法与鉴定要求IPC/JEDEC-9702IPC/JEDEC-9702Monotonic Bend Characterization of Board-Level Interconnects平板互连的单一弯曲特性IPC-PD-335IPC-PD-335Electronic Packaging Handbook电子封装手册IPC-7525IPC-7525Stencil Design Guidelines网版设计导则IPC-QLIPC-QL 365A365ACertification of Facilities That Inspect/Test Printed Boards,Components and Materials印制板, 元件和材料检验/试验企业的授证IPC-9191IPC-9191General Guidelines for Implementation of Statistical ProcessControl统计过程控制导则IPC-TR-581IPC-TR-581IPC Phase III Controlled Atmosphere Soldering StudyIPC 第3阶段受控气氛焊接研究IPC-MI-660IPC-MI-660Incoming Inspection of Raw Materials Manual原材料接收检验手册IPC/EIAIPC/EIA J-STD-004AJ-STD-004ARequirements for Soldering Fluxes-Includes Amendment 1锡焊焊剂要求（包括修改。