（毕业设计论文）《SMT设备及AOI测试》.doc

精品苏州工业园区职业技术学院苏州工业园区职业技术学院毕业设计（论文）毕业设计（论文）毕业设计（论文）届届课题名称：课题名称： SMT 设备及设备及 AOI 测试测试 专业名称：专业名称： 微电子微电子 姓姓 名：名： 学学 号：号： 班班 级：级： 指导教师：指导教师： 精品 苏州工业园区职业技术学院苏州工业园区职业技术学院毕毕业业设设计计（（论论文文））任任务务书书系部： 电子工程系 设设计计（（论论文文））题题目目：： SMT 设设备备及及 AOI 测测试试指指导导教教师师：： 职职称称：：工工程程师师类类别别：：毕毕业业论论文文学学 生生：： 专专业业：： 微微电电子子班班级级：： 02371、、设设计计（（论论文文））的的主主要要任任务务及及目目标标实实践践来来提提高高自自身身的的能能力力2、、设设计计（（论论文文））的的主主要要内内容容有有关关 SMT 设设备备的的介介绍绍AOI 的的简简述述3、、主主要要参参考考文文献献蔡建国：《电子设备结构与工艺》 ，湖北科学技术出版社 2004 年第 2版袁少伟：《SMT 工艺及设备》精品4、、进进度度安安排排设设计计（（论论文文））各各阶阶段段任任务务起起止止日日期期1 论论文文整整体体结结构构4.62 收收集集资资料料4.153 初初稿稿完完成成5.54 修修订订初初稿稿5.205 定定稿稿5.30精品 摘摘要要SMT 是指有关如何将基板、元件通过有效工艺材料和工艺组装起来。

并确保有 良好寿命的一门科技半成品的良与不良取决与印刷的好坏，因此印刷机设备的质 量尤为重要贴片机是否能处理我们设计时所选的元件，把他们都准确的贴在所需 的位置上，这就要对设备的灵活性方面有些了解回流焊的重点为回流曲线，它的 关键在于将产品板上最热和最冷点找出通过对炉温的调制使这两点的范围设置在 锡膏性能的要求范围内应用上对知识的要求也较高，设备保养要求也高 AOI 机器使用一个标准板传送带来在摄像机下面移动PCB，通过简单高频荧光管 来照明随着板在传送带上按刻度移动，在摄像机排列之下通过，通过将图像的立 体象对排列构成一幅照相镶嵌图（photo-mosaic image）然后这个照相镶嵌图合成 地变平和实时地分析关键词： SMT 印刷机 贴片机 回流焊 AOI 机器精品 目目录录一、概述 ······························································································ ······1 （一）了解表面安装 ················································································1 （二）对表面安装元件装贴的实际考虑 ····················································2（三） SMT 流程框图 ················································································2二、印刷机····································································································4 （一）按自动化程度分 类················································································4 （二）按网版及印刷台的形式分 类····································································5 （三）按承印物形状分 类················································································5 （四）印刷时要注意的问 题·············································································5 三、贴片机···································································································· 6（一）贴片机类型·························································································6 （二）表面组装工艺对贴片胶的要 求·································································7 （三）注意事项····························································································7四、回流焊···································································································· 8（一）工作原理···························································································· 8（二）一些不良原因分精品析················································································ 8（三）有关原因及解决措施············································································· 9五、自动光学检查··························································································· 10 （一）设备简 介·························································································· 10 （二）实施目 标·························································································· 10 （三）放置位置···························································································10 （四）AOI 的优 点······················································································· 11 （五）传统 AOI 系统的局 限·········································································· 12 结束语·········································································································13 参考文献 ······························································································ ····14精品 一一、、概概述述表面安装技术（SMT）是最新一代电子装联技术，该技术已经广泛地用于各个领域的电子装联中，本文将就面向 21 世纪的表面安装技术发展特点、相关设备的技术动向，作一些简单地介绍。

表面安装技术（SMT）作为新一代电子装联技术已经渗透到各个领域，SMT 发展迅速、应用广泛，在许多领域中已经或完全取代传统的电子装联技术，SMT 以自身的特点和优势，使电子装联技术产生了根本的、革命性的变革，在应用过程中，SMT在不断地发展完善我国从八十年代初开始尝试引进这种技术，到八十年代中期开始实际应用，进入九十年代随着我国经济的快速发展而得到广泛的应用，SMT 已成为电子装联技术工艺水平的衡量尺度，没有采用 SMT 的电子装联会被认为是落后的工艺水平因此，SMT 不仅在电子行业，而且在我国多种行业中得到了广泛的应用一）了解表面安装（一）了解表面安装过去，元件的封装形式主要是插脚封装和扁平封装，现在这些传统封装的元件已越来越多地被表面安装元件所代替比较一下它们的封装特点以及对系统带来利弊，可以发现为什么表面安装会受到如此普遍的欢迎1) 插脚封装：要求在印制板上打孔，把插脚切短，上锡，插入印制背面再进行焊接，其中大量的都是手工操作；(2) 扁平封装：不仅要求在印制板上打孔，还要在板上按照元件尺寸开一小窗口，将元件引线折弯 90°，将元件放入窗口内折弯引线可能损伤玻珠至金属壳体间的密封性，将引线插入小孔并将元件放入窗口内都是很繁杂的加工。

3)表面安装：印制板上没有孔或窗口，元件直接紧贴在印制板上，缩短了引线，电路装配更易于实现自动化用小的表面安装元件，可以节省印制板上的大量空间，对大多数系统而言，当元件装在电路板一面时，电路板面积可以减小两倍，当元件装到电路板两面时，又可以减小两倍，而且由于表面安装元件的高度一般都比较小，电路的密度可以增另两倍，这就可以大大减小系统的体积使用表面安装，由于引线的缩短，相对插脚元件而言，可以大大降低引线电感，寄生电容和电阻，因而各个元件的延迟时间缩短，使电路有更快的响应速度，使系统的电性能获得较大提高像任何封装元件有它的装配工艺一样，表面安装元件安装也有自己的要求，表面安装的步骤如下 ：(1) 印上焊膏；(2) 放置元件；(3) 通过回流焊使元件与印制板上的电路焊接起来；(4) 清洗，宜用化学脱脂剂当有些元件是不密封时，清洗以后，要求烘干去湿，以确保元件恢复正常功能用一个贴片机完成的工作量，相当于三、四台标准穿孔引线机所完成的工作量，而且一个自动的表面安装生产线，不仅节省了空间、人力，减少工艺流程，缩短生产日期，而且利用统精品计过程的数据控制，快速反馈，更有助于提高产品的产量和质量二）对表面安装元件装贴的实际考虑（二）对表面安装元件装贴的实际考虑什么样的自动焊接方法可以认为适用于表面安装元器件呢？有两种基本方法：回流焊接和波峰焊。

回流焊通常用于下面的情况：(1)只有表面安装元器件，或者(2)表面安装元器件与通孔元器件同时存在，而通孔元器件用另外(波焊)的方法焊接在采用回流焊时，电路板的上面和下面都可以安放表面安装元器件波峰焊可适用于安装在电路板底部的表面安装元器件，也适用于安装在电路板顶部的通孔元器件陶瓷和聚合物基板均能适应 (1) 回流焊回流焊要求在待连接的表面施以可控量的焊膏和溶剂通用技术是印刷电路板上的焊膏图形，然后把元器。