工程英文确认常用词及语句(共8页).doc

精选优质文档-----倾情为你奉上工 程 英 文 确 认 常 用 词 及 常 用 语 句 汇 总专心---专注---专业单词1. 附件：attached (attachment)2. 样品：sample3. 承认：approval4. 答复：answer;reply5. 规格：spec (specification)6. 与...同样的：the same as (identical to)7. 前版本：previous version(old version)8. 生产：production9. 确认：confirm10. 再次确认：double confirm11. 工程问题：engineering query（EQ）12. 尽快：ASAP(as soon as possible)13. 生产文件：production gerber14. 联系某人：contact somebody15. 提交样板：submit sample16. 交货期：delivery date17. 电测成本：ET（electrical test） cost18. 通断测试：Open and short testing19. 参考：refer to20. IPC标准：IPC standard21. IPC二级：IPC class 222. 可接受的：acceptable23. 允许：permit (allow)24. 制造：manufacture (fabricate)25. 修改：revise /amend /change /modify26. 公差：tolerance27. 忽略：ignore(omit)28. 工具孔：tooling hole29. 安装孔：mounting hole30. 元件孔：component hole31. 槽孔：slot32. 邮票孔：snap off hole (break – off holes)33. 导通孔：via34. 盲孔： blind via35. 埋孔：buried via36. 金属化孔：PTH(plating through hole)37. 非金属化孔：NPTH( no plating through hole)38. 孔位：hole location (position)39. 避免：avoid (in case of)40. 原设计：original design41. 修改：modify42. 按原设计：leave it as it is43. 附边：waste tab44. 铜条：copper strip45. 拼板强度：panel strength46. 板厚：board thickness47. 删除：remove(delete /erase)48. 削铜：shave the copper49. 露铜：copper exposure50. 光标点：fiducial mark51. 不同：be different from(differ from)52. 内弧：inside radius53. 焊环：annular ring54. 单板尺寸：single size55. 拼板尺寸：panel size56. 铣：routing57. 铣刀：router58. V-cut：scoring59. 哑光：matt60. 光亮的：glossy61. 锡珠：solder ball(solder plugs)62. 阻焊：solder mask(solder resist)63. 阻焊开窗：solder mask opening64. 单面开窗：single side mask opening65. 补油：touch up solder mask66. 补线：track welds67. 毛刺：burrs68. 去毛刺：deburr69. 镀层厚度：plating thickness70. 清洁度：cleanliness71. 离子污染：ionic contamination72. 阻燃性：flammability retardant73. 黑化：black oxidation74. 棕化：brown oxidation75. 红化：red oxidation76. 可焊性：solderability77. 焊料：solder78. 包装：packaging79. 角标：corner mark80. 特性阻抗：characteristic impedance81. 差分阻抗：differential impedance82. 正像：positive83. 负片：negative84. 镜像：mirror85. 线宽：conductor width86. 线距：conductor spacing87. 做样：build sample88. 按照：as per89. 成品：finished90. 做变更：make the change91. 相类似：similar to92. 规格：specification93. 下移：shift down94. 垂直地：vertically95. 水平的：horizontally96. 增大：increase97. 缩小：decrease98. 表面处理：Surface Finishing 99. 波峰焊：wave solder100. 钻孔数据：drilling date101. 标记：Logo (marking)102. Ul 标记：Ul Marking103. 蚀刻标记：etched marking104. 周期：date code105. 翘曲：bow and twist106. 外层：outer layer107. 内层：internal layer108. 顶层：top layer109. 底层：bottom layer110. 元件面：component side111. 焊接面：solder side112. 阻焊层：solder mask layer113. 丝印层：legend layer (silkscreen layer)114. 兰胶层：peelable SM layer115. 贴片层：paste mask layer116. 碳油层：carbon layer117. 外形层：outline layer(profile layer)118. 白油：white ink119. 绿油：green ink120. 喷锡：hot air leveling (HAL) =hot air solder leveling (HASL)121. 水金：flash gold122. 插头镀金：plated gold edge-board contacts (gold finger)123. 金手指：Gold-finger124. 防氧化：Entek(OSP)125. 沉金：Immersion gold (chem. Gold)126. 沉锡：Immersion Tin(chem.Tin)127. 沉银：Immersion Silver (chem. silver)128. 单面板：single sided board129. 双面板：double sided board130. 多层板：multilayer board131. 刚性板：rigid board132. 挠性板：flexible board133. 刚挠板：flex-rigid board134. 铣：CNC (mill , routing)135. 冲：punching136. 倒角：beveling 137. 倒斜角：chamfer138. 倒圆角：fillet139. 尺寸：dimension140. 材料：material141. 介电常数：Dielectric constant142. 菲林：film143. 成像：Imaging144. 板镀：Panel Plating145. 图镀：Pattern Plating146. 后清洗：Final Cleaning147. 叠层：layup (stack-up)148. 污染焊盘：contaminate pad149. 分孔图：drill chart150. 度数：degree151. 被…覆盖：be covered with152. 负公差：minus tolerance153. 标靶盘： target pad154. 外形公差：routing tolerance155. 芯板：core常用语句－、厚度1. 要求孔内铜厚0.001",超过了IPC二级标准，我们建议按IPC二级0.0008"。

The copper thickness of the wall of the plated-through holes is specified 0.001". It's exceeding IPC class 2 and We suggest as per IPC class 2.that's to say ,It's 0.0008" .2.要求金手指镀金厚度为1.2-1.5um，超过IPC标准太多，建议按我们常规0.45umThe plating thickness of Au in edge contact is specified 1.2-1.5um,it exceed IPC standard too much we suggest following standard ,thickness 0.45um instead.3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZThe copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate up to 2OZ. 4.要求锡厚为0.0005-0.003"，相对IPC标准要求难很多，建议按IPC二级，即保证可焊性，The solder thickness required 0.0005-0.003" ,it is much more than IPC std. .We suggest following IPC class 2 this is to say to assure the solderability. 二、公差1. XXX.的尺寸公差为+/-0.005，建议按IPC二级标准也就是+/-10mil，或我方最好控制能力+/-8mil生产。

The tolerance of dimension is specified XXX.+/-0.005" .we recommend as per IPC class 2 as we previously agreed ,this is to say +/-10mil,or +/-8mil that is our best we meet.2.在*.pdf文件中要求。