ESL电子纸屏说明书英文版.doc

ESL电子纸屏说明书英文版 WF021-01B Product Specification TECHNICAL SPECIFICATION MODEL NO: WF021-01BThe content of this information is subject to changed with out notice.Please contact WF or its agent for further information.□ Customer’s ConfirmationCustomer: Date: By: □WF’s Confirmation Confirmed By: Prepared By: Revision HistoryRev.Issued DateRevised Contents1.0Jul. 1,2011Preliminary1.1SEP.4.20111. Modify Mechanical Drawing of EPD module2. Delete 7-3-1-2) MCU Parallel 6800-series Interface3. Delete7-3-1-3) MCU Parallel 8080-series Interface4. Delete7-3-2) Timing Characteristics of 6800-Series MCU Parallel Interface5. Delete 7-3-3)Timing Characteristics of 8080-Series MCU Parallel Interface6. Figure . 7-6 (1) Modify 41 pin conector to 24 pin connectorTECHNICAL SPECIFICATIONCONTENTSNO.ITEMPAGE-Cover1-Revision History2 -Contents31Application42Features43Mechanical Specifications44Mechanical Drawing of EPD module55Input/Output Terminals66Command Table107Electrical Characteristics138Typical Operating Sequence219Optical Characteristics2310Handling, Safety and Environment Requirements2511Reliability test2612Block Diagram271. Over ViewThe display is a TFT active matrix electrophoretic display , with interface and a reference system design. The 2.04” active area contains 172×72 pixels, and has 1-bit and 2-bit full display capabilities. An integrated circuit contains gate buffer, source buffer, interface, timing control logic, oscillator, DC-DC. SRAM. LUT ,VCOM, and border are supplied with each panel.2. Features ◆High contrast ◆High reflectance ◆Ultra wide viewing angle ◆Ultra low power consumption ◆Pure reflective mode ◆Bi-stable ◆Commercial temperature range ◆Landscape, portrait mode ◆Antiglare hard-coated front-surface ◆Low current deep sleep mode ◆On chip display RAM ◆Waveform stored in On-chip OTP ◆Serial peripheral interface available ◆On-chip oscillator ◆On-chip booster and regulator control for generating VCOM, Gate and source driving voltage . ◆I2C Signal Master Interface to read external temperature sensor ◆Available in COG package IC thickness 250um3. Mechanical SpecificationsParameterSpecificationsUnitRemarkScreen Size2.04InchDisplay Resolution172(H)×72(V)PixelDpi:95Active Area20.16(H)×48.16(V)MmPixel Pitch0.280×0.280MmPixel ConfigurationRectangleOutline Dimension29.20(H×59.20(V) ×1.18(D)MmWeight4±0.5g4. Mechanical Drawing of EPD module5. Input/Output Terminals5-1) Pin out ListPin #TypeSingleDescriptionRemark1NCDo not connect with other NC pinsKeep Open2OGDRN-Channel MOSFET Gate Drive Control3ORESECurrent Sense Input for the Control Loop4CVGLNegative Gate driving voltage5CVGHPositive Gate driving voltage6OTSCLI2C Interface to digital temperature sensor Clock pin7I/OTSDAI2C Interface to digital temperature sensor Date pin8IBS1Bus selection pinNote 5-59OBUSYBusy state output pinNote 5-410IRES #ResetNote 5-311ID/C #Data /Command control pinNote 5-212ICS #Chip Select input pinNote 5-113I/OD0serial clock pin (SPI)14I/OD1serial data pin (SPI)15CVDDIOPower for interface logic pins16IVCIPower Supply pin for the chip17VSSGround18CVDDCore logic power pin19CVPPPower Supply for OTP Programming20CVSHPositive Source driving voltage21CPREVGHPower Supply pin for VGH and VSH22CVSLNegative Source driving voltage23CPREVGLPower Supply pin for VCOM, VGL and VSL24CVCOMVCOM driving voltageNote 5-1: This pin is the chip select input connecting to the MCU. The chip is enabled for MCU communication only when CS# is pulled LOW in parallel interface. When CS# is not in use, please connect to VCI or VSS.Note 5-2: This pin is Data/Command control pin connecting to the MCU. When the pin is pulled HIGH, the data at [7:0] will be interpreted as data. When the pin is pulled LOW, the data at D[7:0] will be interpreted as command.Note 5-3: This pin is reset signal input. Active Low.Note 5-4:This pin is Busy state output pin. When Busy is High, the operation of 。