LCD制程简介含ODF-简体.ppt
46页
蘇榮華,1,LCD制程简介,,Page2,TFT-LCD制程流程,Page3,面板世代廠,Page4,LCD Panel构造,,LCD PANEL构造图,Page5,,Page6,,Page7,TN Type Panel,TN Type Panel需经过配向制程，使液晶产生预倾角，电压驱动时利用液晶倾斜角度的变化使光源穿透或阻挡. (Normally White:未驱动时为白色),Page8,MVA Type Panel,MVA Type Panel不需经配向制程，液晶与基板呈垂直站立状 (Normally Black:未驱动时为黑色),Page9,TN vs. MVA Type 在制程上的差异 PI/LC/End Seal…等材料及制程参数不同,Page10,Panel制作,,,,,,,,CF,CF,CF,CF,CF,CF,,,,,,,,,TFT,TFT,TFT,TFT,TFT,TFT,,,,,,,,,,,,,,,,,,,,,Panel,Page11,,,,,,,,O,O,O,O,O,O,,,,,,,,,O,O,O,O,X,X,,CF 84%,TFT 84%,,,,,,,,,,,,,,,,,,,,Panel Yield 67%,O,O,O,O,X,X,Page12,LCD Process Flow Chart (Conventional),,,,TFT,基板投入,,,,单板切割,,,,基板洗净,,,,PI,印刷,,,,PI,预烤,,,,PI,硬烤,,,,配向,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,CF,基板投入,,,,单板切割,,,,基板洗净,,,,PI,印刷,,,,PI,预烤,,,,PI,硬烤,,,,配向,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,银胶打点,,,,基板组立,,,,热压着,,,,,,,,,,,CELL,后制程,,,,,,,,,,,,基板洗净,/,干燥,,,,,,,,,,,基板洗净,/,干燥,,,,间隔剂散布,,,,框胶,涂写,,LCD PANEL,,,,Page13,LCD Process Flow Chart (ODF),Page14,LCD Process Flow Chart,LCD PANEL后工程流程图,,,,NHAD,NHBD,,Page15,LCD PI印刷前洗净制程,Page16,LCD PI印刷前洗净制程,Page17,PI制程原理,Page18,LCD配向制程-1,Page19,LCD配向制程-2,Page20,如何判断LC分子是左旋或右旋,Page21,LCD配向后洗净制程,Page22,LCD框胶涂布/银胶打点制程,Page23,LCD间隔剂散布制程,Page24,LCD间隔剂散布制程,,Spacer,,,,,,间隔剂散布工程(Dry Spacer Spray),,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,Sprinkler,,TFT基板,,Page25,LCD面板组立制程,,面板组立工程(Panel Aligner),Page26,LCD Cell former,Page27,Cellgap的决定,Page28,LCD Process Flowchart( ODF ),,,,TFT,基板投入,,,,单板切割,,,,基板洗净,,,,PI,印刷,,,,PI,预烤,,,,PI,硬烤,,,,配向,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,CF,基板投入,,,,单板切割,,,,基板洗净,,,,PI,印刷,,,,PI,预烤,,,,PI,硬烤,,,,配向,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,银胶打点,,,,ODF,,,,热压着,,,,,,,,,,,CELL,后制程,,,,,,,,,,,,,,,,,,,,,,,,,基板洗净,/,干燥,,,,,,,,,,,基板洗净,/,干燥,,,,,框胶,涂写,,,,,,,,,,LCD PANEL,Page29,ODF(One Drop Filling)原理,Page30,ODF设备简介,Page31,LCD Process Flow Chart,LCD PANEL后工程流程图,,,,NHAD,NHBD,,Page32,LCD Cell切割裂片制程-1,Page33,LCD Cell切割裂片制程-2,Page34,LC Filling & End Seal制程原理-1,液晶注入工程(LC Filling),Page35,LC Filling & End Seal制程原理-2,End seal,Page36,LCD Realign Oven,Page37,LCD Panel Clean,Page38,磨边导角工程(ABVL),Page39,ACRM Process,,刮除异物工程(ACRM),去除Panel表面异物 1. Cullet 2.End-Seal 3. 表面其它脏污,Page40,SRCN Process,,,,,,,,面板整列部 VCR,R/B 洗净部,温风干燥,除电部,Rinse (F/S),拧干部,HPMJ,L/D Conveyor,表面 clean,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,磨边后洗净机,一次外观,磨边后(表面清洁后) ，Light-On前表面残留Particle清洁 端子部清洁,Page41,LOT 1 点灯测试,,Light on test,,,偏贴前Light On点灯测试,Page42,PACN Process,面板整列部 VCR,R/B 洗净部,温风干燥,除电部,Rinse (F/S),拧干部,HPMJ,L/D Conveyor,表面 clean,,,磨边后洗净机,一次外观,偏光板贴付前，玻璃表面之清洁 避免Panel于偏贴前受污染 提供洁净之Panel至偏贴机,Page43,APAM Process,,偏光板贴附工程(APAM),穩定之偏光板自动贴附,Page44,LOT 2 点灯测试,,Light on test,,,偏贴后Light On点灯测试,Page45,Packing Process,Shipping Typea. PP Box(粉红色冰淇淋盒)b. 黑色静电箱c. Dense Packd. Hard Casef. Cassette,Hard Case,Dense Pack,PP Box,黑色静电箱,Cassette,蘇榮華,46,Q & A,Thinks!,。
