FPC-专业词汇-中英文对照(共8页).doc

精选优质文档-----倾情为你奉上FPC名词中英对照1. 目的 通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化2. 适用范围 规范FPC相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词3. 定义 无类别一：FPC不良项目名词工程类别不良名称中文英 文导线Visual Inspection of Conductors导线Conductors开路Open短路Short缺口Nicks针孔Pinholes额外铜刺Extraneous Copper Between Conductors毛刺Spurs结瘤Nodules蚀刻凹痕Etched Concave导线分层Conductor Delamination裂纹Cracks导线划痕Scratches on Conductor凹坑Dents变色Discoloration基底薄膜Visual Inspection of Base Film凹坑Dents划痕Scratches on Base Film覆盖层和覆盖涂层Visual Inspection of Coverlay and Covercoat凹坑Dents on Coverlay and Covercoat划痕Scratches on Coverlay and Covercoat空洞Void偏位Coverlay Misalign毛刺Coverlay Burrs外来物Foreign Matters导电性异物Conductive Foreign Matters非电性异物Non-conductive Foreign Matters起泡和分层Blistering and Delamination覆盖层粘结剂挤出Squeeze-out of Adhesive of Coverlay覆盖涂层渗出Ooze-out of Covercoat覆盖涂层跳漏Skipping of Convercoat电镀金属或焊锡的表面条件Surface Condition of Plated Mental and Solder镀金Gold Plating镀金层缺陷Gold Plating Defects镀锡Tin Plating电镀金属或焊料的渗透Penetration of Plated Metal or Solder变暗（变黑）Darkened Appearance (Blackening Discoloration)镀铜孔内镀层空洞Plating Voids in Plated-though Hole镀金粗糙Rough Gold镀金白雾Gold Discoloration镀金变色Gold Discoloration镀金层龟裂Gold Crack镀金针孔Gold Pinhole电镀露铜Plated Expose Wetting剥离Plated Peeled Off电镀渗入Plated Wicking漏镀No Plating表面伤痕Plating Scratch电镀粗糙Rough Plated药水渗入Wicking外形和孔边缘Visual Inspection of Edges of Outline and Holes撕裂和缺口Tears and Nicks毛刺Burrs丝状毛刺Thready Burrs弯曲、变形Warpage微连筋不良Poor Micro-joint外形偏移Outline Misalign外形漏冲No Outline反折偏位Bending Line Misalign增强板Visual Imperfections Related to Stiffener BondingFPC与增强板之间的外来物Foreign Matter Between Flexible Printed Board and StiffenerFPC与增强板之间的空洞Voids Between Flexible Printed Board and Stiffener裂纹Cracks缺角Chip-off划痕Scratches变形Deformation表面附着物Affixed Substances on the Surface增强板贴偏移Stiffener Misalign热固胶Thermosetting Adhesive焊剂残渣Flux Residues金属粉末残渣Residue of Metal Powders粘结剂残渣Residue of Adhesive突起Protrusions凹坑Dents弓曲Bow扭曲Twist标记Marking尺寸检验Dimensional Inspections尺寸测量Measurement of Dimensions外部尺寸External Dimensions厚度Thickness孔Holes元件孔Component Holes导通孔Via Holes导通孔偏移Via Hole Misalign安装孔Mounting Holes导线宽度Conductor Widths导线之间的间距Clearances Between Conductors孔中心间距Distance Between Hole Centers板边和导线之间的最小距离Minimum Distance Between Board Edges and Conductors标记错误Wrong Marking字符不清晰Unclear Letter定位精度Positional Accuracy孔的定位精度Positional Accuracy of Holes孔与焊盘的重合性Registration of Hole to Land覆盖层与焊盘的重合性Registration of Coverlay (or Covercoat) to Land增强板与FPC的重合性Registration of Stiffener to FPC孔的重合性Registration of Holes外形的重合性Registration of Outlines冲外形与导线图形的重合性Registration of Punched Outline to Conductor Patterns压敏胶或热固胶与FPC和增强板的重合性Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener镀通孔的镀铜层厚度Plating Thickness of Copper Panted-through Holes其它Other短装Shortage混装Mixed Stowage/Packing离型纸脱落Released Paper Peeled off材料错误Wrong Material 类别二：PFC工程用语工程类别中 文英 文板Board Type单面板Single Sided Flex Circuits单面双接触Double Access or Back-bared Flex Circuits双面板Double Sided Flex Circuits软硬结合板Rigid-flex Circuits模具Die模具图纸Die Drawing量产模具Mass Production Die样品模具 Prototype Die钢模Steel Die刀模Die上模Top Die下模Bottom Die线切割Wire Cut外形模具Outline Cut保护膜模具Coverlay Die胶纸模具Pressure Sensitive Adhesive Die补强模具 Stiffener Die银浆模具Silver Die 导柱Post冲头Punch分割刀模Cutting Steel Rule Die销钉Pin治具Jig( Fixture)贴合治具Lamination Jig电测治具Electrical Check Jig假贴治具Tacking Jig曝光治具Exposure Jig丝印网框Screen Printing Frame孔Hole曝光定位孔Guide Hole for Exposure模具定位孔Guide Hole for Die假贴定位孔Guide Hole for Tacking贴合定位孔Guide Hole for Adhesive电测定位孔Guide Hole for Electrical Test丝印定位孔Guide Hole for Screen Printing孔环Lifted Land渗锡孔Stannize Hole装配孔Fitting Hole制程Manufacture Procedure下料Material Preparation钻孔Drilling镀铜Copper Plating化学铜Ele Eletcroless Plating Copper贴干膜Sensitive Dry Film 丝印阻焊油墨Liquid Photosensitive Soldermask曝光Exposure显影Developing蚀刻Etching脱膜Stripping贴保护膜Tacking Coverlay粗化Abrade层压Lamination固化(烘烤）Curing黑孔Black Hole表面处理Surface Treatment循环水洗Cascade Rinse微蚀Micro-etch酸洗Acid Cleaning水洗Water Cleaning防锈处理Anti-corrosion Treatment前处理Pre-treatment刷板Brushing干燥Dry up电镀（金、锡、镍）(Gold、Solder、Nickel) Plating闪镀(Gold ) Flash Plating/Strike Plating局部电镀Pattern Plate化学镍金Immersion Gold有机保焊膜Organic Solderability Preservatives (OSP)丝印字符Printing of Legend贴补强板Back Board Lamination电性能测试Electri。