IT180AI板材说明.doc

ITEQHighTg/LeadFree/HighReliabilityLaminate&Prepreg• ExcellentCAFresistanee• Goodthrough-holereliability• LowCTEandhighthermalreliability• Forautomotive,highlayerPCB,networking,andheavycopperapplicationsLaminatepropertiesItemsIPCTM-650TypicalValueUnitPeelStrength,minimumA.Lowprofilecopperfoil2.4.85lb/inchB.Standardprofilecopperfoil8VolumeResistivity2.5.17.11x109M€-cmSurfaceResistivity2.5.17.11x108M€MoistureAbsorption,maximum2.6.2.10.10%Permittivity(Dk,50%resincontent)A.1GHz4.4B.2GHz2.5.5.134.3--C.5GHz4.1D.10GHz4.1LossTangent(Df,50%resincontent)A.1GHz0.015B.2GHz2.5.5.130.015--C.5GHz0.016D.10GHz0.016FlexuralStrength,minimumA.Lengthdirection2.4.4500-530N/mm2B.Crossdirection410-440ThermalStress10sat288°CA.Unetched2.4.13.1PassRatingB.EtchedPassFlammabilityUL94V-0RatingGlassTransitionTemperature(DSC)2.4.25175°CDecompositionTemperature2.4.24.6345°CX/YAxisCTE(409to125°C)2.4.2411-13/13-15ppm/°CZ-AxisCTEA.Alpha12.4.2445ppm/°CB.Alpha2210ppm/°CC.50to260DegreesC2.7%ThermalResistaneeA.T2602.4.24.1>60MinutesB.T28820MinutesREV2.0-17。