PCB专用辞.doc

板材空洞：Laminate voids附着力：Adhesion白斑：Blaze or measling性能 ：Property剥离：Peel off气泡：Pubble水泡：Blister磨光：Polish (repolish, 再抛光)超声波清洗：Ultrasonic cleaning标准: Criteria校准：Calibration在室内周围环境下：At room ambient condition大气压力压迫：Barometric pressure观察者：Observer符号：Notation根本原因分析：Root cause analysis分歧点：Divergent point范本,样品实验物，标本，样品：Specimen使用不当：Improper use透彻的复检: Intensive re-examination无充足的预热：Insufficient warm up先后顺序的不正确：Incorrect sequencing显示差异性：Indicate discrepancy粗糙的磨砂尺寸：Coarse grit sizes在水下清洗或在去除离子的水清洗去蚀刻：Rinse in running tap or deionized water to remove enchant切片：Cross-section显微镜照片：Metallograph树脂缩小：Resin recession电镀不均：Plating uniformity镀层空洞：Plating voids毛刺：Burr(metallic or nonmetallic burrs,金属或非金属毛刺 )缺口: Nicks划伤、刮花: Scratch割槽：Gouges判断的精确：Nicety of judgment.表层缺陷：Surface imperfection表层下缺陷: Subsurface imperfection外来夹杂物：Foreign inclusions (foreign material/foreign projects)粉红圈：Pink ring附着力下降：Loss of adhesion导电图形的缺陷：Imperfection of conductive pattern由缺口引起的线宽或厚度的减小: Reduction of conductor width or thickness due to nicks针孔：Pin hole表面电镀或涂层缺陷：Surface plating or coating defects重合度：Misregistration分层：Delamination自然损坏： Physical damage防焊表面涂层缺陷：Solder Resist surface coating imperfection外型的准确度：Pattern accuracy环孔：Annular ring晕圈：Haloing(penetration of haloing 晕圈的渗透) 漏织物：Weave voids不规则的形状：Irregular shape小块 small lumps表面突起: Convex to surface微裂纹:Cracking超过：Span板层：Ply保护层：Protective coating超声波或电磁辐射的传播 propagation邻近的: Adjacent镶嵌在板中的半透明颗粒/不透明颗粒： Translucent / opaque particle trapped within the boards漏织物/布纹 eave exposure/fexture漏纤维/纤维断裂：Exposed/disrupted fibers麻点和空洞:Pits and voids开槽钉/定缝销钉：Dowel pinSpindle不润湿/润湿:Nonwetting/Dewetting绝缘材料：Insulating material表明、证明：Manifest 与机械应力有关：Related to the mechanically induced stress未受影响的距离：The unaffected distance导线：(Closest) Conductive Pattern非破坏性的可视标准: Nondestructive visual criteria夹具：Jig污染：Contamination稳定性：Stability磨板拉: Scrubble line表面的缺陷：Cosmetic imperfection铜箔翘起：Foil flare铜皮入孔: Foil intrusion铜皮覆层: Copper cladding清洁防静电手套: Clean anti-static glove残留的红标签: Rudimental red label铜皮向上: Copper side upward行辘: Running roller变色:Discoloration外围:Periphery (wide around the pin periphery)刚性多层印制线路板：Rigid multiplayer printed circuit boards赤铜色: Copper-clad更换过滤器: Replace filter稀排行辘: Sparsely arranged roller密排行辘: Closely arranged roller白色节式滚轮: White vertebrate roller加压水洗: Pressurized water rinse请水洗: Fresh water rinse水柱式冲洗: JET Cleaning 水柱式喷嘴: JET nozzle止水洗: Concentrated rinse故障: Malfunction阻塞:Abstruct故障处理程序: Exception handles油铲子: Ink Scoop粘合、粘附: Conglutinate粘合性能：Adhesion property兼容性：Compatibilityso far to increased productivity 以便于提供产能可燃性 Flammability体积电阻率 Volume resistivity 离解(电离、耗解)常数:Dissipation constant介质穿击: Dielectric constant防潮材料 damp-poor materialBeware of moisture, always keep wrapped in damp-proof material, were kept in normal condition.以防潮湿，一贯采用防潮材料包装，以保持在正常条件下储存。

Pregreg might absorb moisture and its bonding strength would be weakened.半固化片一受潮，它的粘结性能将会降低图像转移：Image transferring防白水：DMF water纤维屑：Loose fiber斜边/倒角边 bevel edge斜角 bevel angle倒角机 beveler制作次序编号 manufacturing sequence number测试点和对位点:Test point and adjustment point时间指示器: Clocking indicator阻焊桥：Solder bridging蚀刻过度 overetching只要文字可以识别 as long as the characters is legible.预烘干 Precure退膜 Striping烘烤后 postcure微蚀 micro etching背光 back lighting垫板 back up黑化 black oxide板厚错误 board thickness error板弯 Bowing/bow碳化物 carbide定位梢 Carlson pin催化 catalyzing倒角 chamfer网筐 chase防焊覆盖错误 coating error协力厂 contract service铜渣 copper residue抗蚀性 corrosion resistance去毛头/去毛刺 deburring空内异物 dirty hole孔灰/孔黑/氧化 discolor hole电镀夹杂物 entrapment蚀刻速率 etch rate光学点 fiducial mark瑕疵/缺陷：Fault喇叭型孔 flare先进先出 first-in-first-out(FIFO)夹头 grip硬化剂 hardener空气滤清器 hepa filter数孔机 hole counter孔径错误 hole diameter error离子污染测试 ionic contamination test相互连通 interconnection强度 intensity相互改变 inter molecular exchangeIPA 异丙醇牛皮纸 Kraft paper压合 laminating or lamination漏电 leakage孔位错误 mis hole location板电 panel plating图形电镀 pattern plating刮刀 squeegee starvation 缺胶transmittance 透光度twist 板翘uneven coating 喷锡厚度不均vertical micro section 垂直切片void/void in PTH hole 破孔yield 良率:Solder mask opening 防焊开窗:Manual laminator 手动辘板机Hold time after exposure 曝光后停留时间HR-Temperature 相对湿度、温度dust control 含尘控制量lamination speed/temperature/pressure 热辘菲林速度/温度/ 压力exposure energy 曝光能量clean exposure tray 清洁曝光台first article quality inspection 首板质量检测breakpoint 显像点developing speed 显影速度/冲板速度acidity etching Conc 酸性蚀刻浓度total acidity 总酸度acidity rinse 酸洗pressure of chemical spray 药水喷射压力gauge meter 机上仪表blocked or reversed 喷嘴有无堵塞或颠倒striping 退膜NaOH Conc：NaOH 浓度Solution Temp 药水温度Conveyer speed 传送速度Post etching 蚀刻后Etching factor 蚀刻因子First article inspection 首板质量检测Line Width 线宽Line spacing 线隙Tester 测试仪Thermohygrograph 温湿度记录仪100X Magnifier 100 倍放大镜activator 活化Thickness of Oxidization 咬蚀深度Supplement MS100. H2SO4 H2O2Brown oxide quality 棕化质量Post brown oxide 棕化后Per customer Spec 按客户标准Ionic contamination tester 离子污染测试机Temp/Humidity chamber 恒温恒湿箱Peel Strength tester 剥离强度测试机Appearance 外观Vacuum degree 真空度CNC Routing Tape/punching mould 锣带/啤模Layers regi。