KS焊线机生产流程及参数控制[参照].pdf

Kulicke 10,000 wires, optional. Wire Diameter 0.7 mil (18 mm) to 1.3 mils (33 mm), standard Eye point Capacity 300 Pattern Recognition System (PRS) eye points per process program NOTE: Some loop shape options are added-cost premium features, and are not included in the standard machine software version. Premium looping features must be added at the factory before machine shipment. Contact any K the other for the lead reference file. Wiring File (.WIR): This file defines the wire interconnections and wire process information. MHS Files (.MAG, .LF, .PHY, .HB, and .IEY): MHS specific information is stored in these files. The .MAG file defines the magazine. The .LF file defines the leadframe and contains physical data for indexing purposes. The .PHY file defines physical attributes of the MHS that are not included in the .MAG or .LF file. The .HB file contains information on the heat block. The IEY file has information on indexing eyepoints. Bonding Parameter File (.PRM): Bonding parameters are stored in this file. Eye Points Information File (.EYE): The die and lead eye points are stored in this file. Application Engineer: Nathan SJ Lee - 29 - 29 / 65 Kulicke in the X axis, vertical edges are needed. F. A lead eye point should contain as many edge directions as possible. 3 Die Geometry Guidelines Since the PRS scans vertically and horizontally, vertical and horizontal alignment of features within the window are preferred. The PRS will reliably locate diodes and discrete devices that are a minimum of 10 x 10 mils. Since only one eye point is used on targets of this size, geometry of the die pad is significant. The following information will help optimize PRS performance: Rectangular shapes provide the most repeatable results. Circular die pads are recognizable but slight shifts in X and Y may not be detected. No rotational correction is possible. Altering the circular design with a rectangular target will improve recognizability. Diagonal die pads are not recommended because the same pattern will be seen anywhere within the diagonal area. Therefore, a slight shift in position may not be detected. However, if the diagonal pad is completely enclosed by the smallest PRS window size, recognition with accuracy is possible. 4 Jumper Chips Jumper chips placed in the same cavity as the die are usually distinguishable from their background when illuminated by the oblique light. Jumper chips have no reliable features: they have either shiny or dull surfaces and are sometimes tilted. However, jumper chips may be located consistently by paying attention to the following guidelines: Use the oblique light to illuminate the package. Use a small window size. Include only the chip corner and its shadow in the window. Select the best device available to teach: jumper chip should be clean, undamaged and nominally located. 5 Video Lead Locator The VLL uses a high-speed video image analysis technique to enable the bonder to find individual outer leads on a package before the bond is made. Application Engineer: Nathan SJ Lee - 45 - 45 / 65 Kulicke loose hardware will severely impair performance. Optical system adjustments (focus, linearity, magnification) must be maintained within specification. Optical surfaces should be free of dirt. Monitor features which do not move when the device image moves indicate dirt on the cameras sensor chip surface. Dirt elsewhere in the optics tends to reduce contrast. 5.1.4 Teach Process Teach scan points on bond locations, if possible. Although not absolutely necessary, this will speed operation. The bonder will remember the offset between the two and make the necessary correction (Figure C-22). Application Engineer: Nathan SJ Lee - 46 - 46 / 65 Kulicke in this situation, manual tip teach should be used. It should also be noted that VLL must be taught on Bond 2, not Bond 1 of a particular wire in order to utilize automatic tip teach properly. 5.3.3 Programmable Bond Distance From Lead Tip A special utility is provided as a supplement to the aforementioned tip teach algorithms, which allows the operator to set the VLL bond position relative to the leads tip. If a displacement value of 6 is entered, all VLL bonds will be placed at a distance of 6 mils from the tips of all corresponding leads. This allows for considerable variation in VLL taught lead position with no corresponding variation in actual bond position. However, if it is desired that the actual bond position coincide with the VLL taught lead position, simply disable this utility by keying in a displacement value of zero. 5.3.4 VLL Lead Tip Find When running the system in the AUTO mode, the VLL automatically searches for lead tips on all leads for which tips have been taught. As is the case with VLL lead location failure, machine stoppage occurs if the VLL cannot locate a particular lead tip. Depending on。