焊接直插式芯片处理方式.doc

焊接直插式芯片处理方式在我们的电脑中，存在着各种各样不同处理芯片，我们经常听说某某芯片采用什么什么的封装方式，那么，它们又是采用何种封装形式呢?并且这些封装形式又有什么样的技术特点以及优越性呢?在本文中，作者将为你介绍几个芯片封装形式的特点和优点In our computer, there are a variety of different processing chip, we often heard that so-and-so what chip is what encapsulation way, so, they form what package? And the packaging form and what kind of technical characteristics and advantages? In this article, the author will introduce you to several characteristics and advantages of chip packaging form. 一、DIP 双列直插式封装First, DIP dual-in-line package DIP 是指采用双列直插形式封装的集成电路芯片，绝大多数中小规模集成电路(IC)均采用这种封装形式，其引脚数一般不超过 100 个。

采用 DIP 封装的 CPU 芯片有两排引脚，需要插入到具有 DIP 结构的芯片插座上当然，也可 以直接插在有相同焊孔数和几何排列的电路板上进行焊接DIP 封装的芯片在从芯片插座上插拔时应特别小心，以免损坏引脚DIP refers to adopt dual in form encapsulation of integrated circuit chips, the vast majority of small and medium scale integrated circuit (IC) all use this kind of packaging, the pin number is generally not more than 100. Use DIP package of CPU chip has two rows of pins, to a DIP structure to be inserted into an outlet on a chip. There are, of course, can be directly inserted in the same hole number and geometric arrangement on the circuit board welding. DIP package of chips from the chip socket should be especially careful about plug, so as not to damage the pins. DIP 封装具有以下特点：(1)适合在 PCB(印刷电路板)上穿孔焊接，操作方便。

2)芯片面积与封装面积之间的比值较大，故体积也较大Intel 系列 CPU 中 8088 就采用这种封装形式，缓存和早期的内存芯片也是这种封装形式DIP package has the following characteristics: (1) suitable for perforation soldering on the PCB (printed circuit board), easy to operate. (2) between the chip area and packaging area ratio is bigger, so the volume is bigger also. Intel cpus in 8088 using this form of encapsulation, cache and early memory chips is also on the packaging form. 二、QFP 塑料方型扁平式封装和 PFP 塑料扁平组件式封装Second, QFP plastic square flat packaging and PFP plastic flat component encapsulation QFP 封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大型集成电路都采用这种封装形式，其引脚数一般在 100 个以上。

用这种形式封装的芯片必须采用 SMD 将芯片与主板焊接起来采用 SMD 安装的芯片不必在主板上打孔，一般在主板表面上有设计好的相应管脚的焊点将芯片各脚对准相应的焊点，即可实现与主板的焊接用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的PFP 方式封装的芯片与 QFP 方式基本相同唯一的区别是QFP 一般为正方形，而 PFP 既可以是正方形，也可以是长方形 QFP encapsulation of small distance between the chip pin, pin is very fine, general large or super large integrated circuit using this form of encapsulation, the pin number in more than 100. Encapsulated in the form of chip SMD chip and motherboard welding must be used up. Mounted with SMD chips don't need to punch on the mainboard, generally in the motherboard have designed corresponding pin on the surface of solder joints. Aim the chip each foot corresponding solder joints, welding can be realized and the main board. Welding up chips in this way, if no special tools are difficult to removed. PFP way to encapsulate and QFP way basically the same chip. The only difference is that QFP is square, and PFP can be square, also can is a rectangle. QFP/PFP 封装具有以下特点：(1)适用于 SMD 表面安装技术在 PCB 电路板上安装布线。

2)适合高频使用3)操作方便，可靠性高4)芯片面积与封装面积之间的比值较小Intel 系列 CPU 中 80286、80386 和某些 486 主板采用这种封装形式QFP/PFP package has the following characteristics: (1) applies to the SMD surface mount technology in PCB wiring installation. (2) suitable for high frequency. (3) easy to operate, high reliability. (4) the chip area and packaging area between the ratio of the smaller. Intel cpus in 80286, 80386, and some 486 motherboard adopts this kind of packaging. 三、PGA 插针网格阵列封装Third, PGA pin grid array encapsulation PGA 芯片封装形式在芯片的内外有多个方阵形的插针，每个方阵形插针沿芯片的四周间隔一定距离排列。

根据引脚数目的多少，可以围成 2~5 圈液压升降机平台安装时，将芯片插入专门的 PGA 插座为使 CPU 能够更方便地安装和拆卸，从 486 芯片开始，出现一种名为 ZIF 的 CPU 插座，专门用来满足 PGA 封装的 CPU 在安装和拆卸上的要求PGA chip packaging form inside and outside of the chip with multiple square shaped pin, each square shaped pin spacing distance around the chip. According to the pin number of how many, can round into 2 ~ 5 times. When installation, insert the chips into special PGA sockets. For the CPU can be more convenient to install and remove, starting from the 486 chip, called ZIF CPU socket, specifically to meet the PGA encapsulation of CPU requirements on installation and disassembly. ZIF 是指零插拔力的插座。

把这种插座上的扳手轻轻抬起，CPU 就可很容易、轻松地插入插座中然后将扳手压回原处，利用插座本身的特殊结构生成的挤压力，将 CPU 的引脚与插座牢牢地接触，酿酒设备绝对不存在接触不良的问题而拆卸 CPU 芯片只需将插座的扳手轻轻抬起，则压力解除，CPU 芯片即可轻松取出PGA 封装具有以下特点：(1)插拔操作更方便，可靠性高2)可适应更高的频率Intel 系列CPU 中，80486 和 Pentium、Pentium Pro 均采用这种封装形式The plug ZIF refers to zero insertion force. Put the socket wrench gently lift, the CPU can be easily, easily inserted into the socket. Then put the wrench back pressure, using the socket itself extrusion pressure generated by the special s。