保护功能测试原理.ppt

DynaPack 順達電子,Principle Of Pack Test---SU,,,,Made By Jade.Hu,,,,Part one： 測試站別以及主要測試項目介紹一. BMU test： 1.CAL test：EEPROM write，calibration etc2.SU test：protect function test二. Pack test 1.CorePccke test：Calibration，IT Enable，EEProm Write，Temperature check，Static Vcell Check，AFE OverCurrent in Discharge，ID check，Fast Charge Current，Over Charge Current Protection，Dynamic Vcell Check，Fast Discharge Current，Current Tolerance Check，EEProm Check，Register Check，Voltage Tolerance Check，Final Voltage Check2. Final Test：Zero Current Check，meter IR、ID，Static Vcell Check，Temperature Tolerance Check，Dynamic Vcell Check，Fast DisCharge Current，Current Tolerance Check，Fast Charge Current，EEProm Write，EEProm Check，Register Check，Voltage Tolerance Check，Seal，Final Voltage Check,,,,,,,,Part two： 保護電路工作原理 Battery protection function Block Diagram,Discharge Mosfet,Charge Mosfet,,,,,,,Protection ICBQ29311,Gas-Gauge ICBQ2083,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,Protection Circuit,,,,UVP,OVP,OCP,,,,OVP . UVP OCP . OTP Cell-balance Total : 8 pins,SMBus V1.1,,,,,Protection IC S-8244,,,,,,,,,Fuse Circuit,PACK-,PACK+,DATA,CLOCK,,,,,,,T,,thermistor,,NA,,,Protection Function,2.1 保護電路,,Bq2084 系統的保護電路有 a、過壓保護（OVP）；b、欠壓保護（UVP）；c、過溫保護（OTP）；d、充電過流保護（OCCP）；e、放電過流保護（ODCP）；短路保護。

其工作原理如下列圖形所示：,,2.1.1 OVP (Over Voltage Protection ),BATT+,GND,,,,,,,,,,,,,,,,,,,,,,,,I2C,,,,,,,,,,,,,,,,,,,,,,,,,,,Sense Resistance,,,,,RT1,,,,,,,,,,,,,,,,,,,,,,,,,RT2,SMD,SMC,,,,,,,,,,,,,1st OVP Vcell > 4.28V C-FET act,Vcell > 4.28V,,,,,,,,,,1st OVP Release All Vcell < 4.1V,2nd OVP Vcell > 4.35V SE-Fuse act,,,,,,,,,,,,,,,,,,,Vcell < 4.1V,Vcell > 4.35V,Non-recoverable!!,Charge Battery,Charge Battery,,,,,,,,,,2.1.2UVP (Under Voltage Protection ),BATT+,GND,,,,,,,,,,,,,,,,,,,,,,,,I2C,,,,,,,,,,,,,,,,,,,,,,,,,,,Sense Resistance,,,,,RT1,,,,,,,,,,,,,,,,,,,,,,,,,RT2,SMD,SMC,,,,,,,,,UVP Vcell < 2.5V D-FET act,Vcell < 2.5V,,,,,Discharge Battery,,,,,,,,,Vcell > 3V,UVP Release All Vcell > 3V & provide a charge action,,,,,,,,,,,,,Charge Battery,> detect current 20mA,,,,,2.1.3 OTP (Over Temperature Protection ),,BATT+,GND,,,,,,,,,,,,,,,,,,,,,,,,I2C,,,,,,,,,,,,,,,,,,,,,,,,,Sense Resistance,,,,,RT1,,,,,,,,,,,,,,,,,,,,,,,,,,RT2,SMD,SMC,,,,,,,,,,Charge OTP Cell Temperature ≥ 60℃ C-FET/ D-FET act,OTP Release Cell Temperature <45℃ (charge) Cell Temperature <55℃ (discharge),,,,,,,I2C,,,,,,,Tcell ≥ 60℃ while charge Tcell ≥ 70℃ while discharge,Tcell < 45℃ (charge) Tcell < 55℃ (discharge),Charge Inhibit Cell Temperature < -10℃/ ≥ 45℃ C-FET act,Discharge OTP Cell Temperature ≥ 70℃ C-FET/ D-FET act,,2.1.4 OCCP (Over Charge Current Protection ),BATT+,GND,,,,,,,,,,,,,,,,,,,,,,,,I2C,,,,,,,,,,,,,,,,,,,,,,,,,Sense Resistance,SE-Fuse,,,,RT1,,,,,,,,,,,,,,,,,,,,,,,,,,RT2,SMD,SMC,,,,,,,,,,,,,,,Charge Current,≥ 4A,,,,,,,,,I2C,OCCP Charge Current ≥ 4A C-FET act,,,,,,,,,,,,,,OCCP Release Delay Time 30~60sec,Or provide a discharge action,2.1.5 ODCP (Over Discharge Current Protection ),,BATT+,GND,,,,,,,,,,,,,,,,,,,,,,,,I2C,,,,,,,,,,,,,,,,,,,,,,,,,Sense Resistance,,,,,RT1,,,,,,,,,,,,,,,,,,,,,,,,,,,,RT2,SMD,SMC,,,,,,,1st ODCP Discharge Current -6.5 ~ -7A D-FET act,,,,,,,,,,,,,,,,,,,,,,I2C,Discharge Current,-6.5 ~ -7A,,,OCCP Release Delay Time 30~60sec,Or provide a charge action,2.1.6 ODCP (Over Discharge Current Protection ),,BATT+,GND,,,,,,,,,,,,,,,,,,,,,,,,I2C,,,,,,,,,,,,,,,,,,,,,,,,,Sense Resistance,,,,,RT1,,,,,,,,,,,,,,,,,,,,,,,,,,,,RT2,SMD,SMC,,,,,,,2nd / 3rd ODCP Discharge Current -8 ~ -10A/ -35A±22% D-FET act,,,,,,,,,,,,,Discharge Current,-8 ~ -10A -35A±22%,,,,,,,,,,OCCP Release Delay Time 30~60sec,Or provide a charge action,,,2.1.7 Short & Reverse Protection,,BATT+,GND,,,,,,,,,,,,,,,,,,,,,,,,I2C,,,,,,,,,,,,,,,,,,,,,,,,,Sense Resistance,,,,,RT1,,,,,,,,,,,,,,,,,,,,,,,,,,,,RT2,SMD,SMC,,,,,,,,,,,,,,,,,,,Short & Reverse Protect Discharge Current >30A/ >0.9ms D-FET act,,,,,,,,,,Discharge Current,Short/ Reverse,> 30A,OCCP Release Delay Time 30~60sec,Or provide a charge action,,,Reverse Release Remove reverse charge,Part three： 測試基本架構,,,PC,,,EV2300,,,Relay Box,,,Battery IC,,Power Supply,,Load,,Meter,,,,Gpib Card,DIO Card,USB,Test system structural drawing,Relay box 的工作原理:當程式向DIO Ports發出寫命令時, DIO 向 relay 的主板送 出Channel、Function Code、Interrup等信息,主板根據這 些信息控制相應的Interface Board 上的Relay 動作,則Relay Interface Board 上的一些LED會亮,表明相應的Relay發生了 動作,其板上的電路導通,便將外部接進來的信號(電壓\電流)接 至50Pin interface上的相應點,或將50Pin interface上的相應 點接通,同時Front panel上的LED顯示相應code.,下面為向DIO Ports寫(&H22) Function命令時,相應的Relay動作的示意圖 ,自動測試機台說明(一),系統---電腦 CPU處理中心,Relay-box 繼電器盒/箱 交通樞紐,,,,,測試及量測儀表等,測試治具 PCBA /Pack,測試步驟 準備工作 A-測試治具與測試機台接線檢查OK. B-測試機台的所有儀器儀表電源打開. C-測試程式開啟及機種參數檔案的選擇 D-首次測試需點start 按鈕 Step1-將PCBA 或PACK放入治具內/和測試治具結OK Step2-測試機台自動測試. Step3-測試結束後取出/開PCBA/PACK流下一站 E-關掉所有儀器儀表電源,自動測試機台說明(二),系統---電腦 CPU處理中心含 1. PCI DIO96信息通訊卡 2. GPIB 信息通訊卡 3.EV2300 SBS 1.1協議通訊卡 4.MAX通訊板卡 5.RS232通訊-電腦內含,板卡分工同時控制不同電源負載和儀表 1. DIO-96板卡控制Relay-Box繼電器箱工作 2.GPIB板卡控制儀器儀表. 3.EV2300板卡電池與電腦做通訊. 4.電腦透過打印並口與MAX板卡通訊 5.電腦透過RS232通訊控制內阻量測,軟體實現原理,。