HDI流程PCB课件.ppt

Mitac China ConfidentialMitac China Confidential順達電腦（廣東）Jan, 2002HDI制程及設計介紹Mitac China ConfidentialMitac China ConfidentialHDI PCB的應用HDI: High Density InterconnectionHDI PCB用在商品上較大宗的有用在商品上較大宗的有3大類大類﹕﹕1.資訊類資訊類﹕超大型電腦、筆記型電腦、IC Substructure（FCPGA-Flee Chip Pin Grid Area）等2.通訊類通訊類﹕手機、通訊系統、網際網絡等3.消費產品消費產品﹕數碼相機Mitac China ConfidentialMitac China ConfidentialHDI及一般PCB用的主要物料介紹Laminate Prepreg RCC Copper FoilLaminateLaminate: 銅箔基板, 由中間的FR4等材質加兩面銅箔組成,主要用來製作內層線路, 銅箔厚度主要有0.5 oz, 1oz等 (基材一般還有分一般FR4材質,High Tg材質,特殊用途材質)Prepreg(P/P):Prepreg(P/P): 玻璃纖維布+環氧樹脂膠片(未聚合),主要作為PCB內層間壓合用的絕緣層,有多種厚度規格RCC:RCC: Resin Coated Copper, 覆樹脂銅箔,樹脂層沒有玻璃布（不同于P/P), 一般銅箔厚度為0.5 oz,主要用於HDI產品增層用（CO2 Laser）, 另有有玻璃布的Prepreg用于CO2 Laser（LDP-Laser Drill Prepreg）Copper Foil:Copper Foil:銅箔,作為一般多層板壓合時外層銅層,主要有0.5 ozS/M:S/M: Solder Mask, 或稱Solder Resist, 主要分為一般/霧面(Matt)兩種,如Taiyo PSR4000(一般)和Ciba PR77(霧面)Mitac China ConfidentialMitac China Confidential一般PCB製作流程簡介1. 內層板製作: 影像轉移, 蝕刻出線路  (線寬間距)2. 將多個內層板壓合成多層板, 以鑽孔,電鍍來連通各層線路(板厚,層數,最小孔孔徑)3. 外層製作: 影像轉移,電鍍,蝕刻做出外層Pattern, 覆蓋S/M4. 成品處理: 對焊墊進行表面處理, 切出成品PCB, 進行檢驗及Open/Short的電性測試, 包裝出貨Mitac China ConfidentialMitac China Confidential內層線路內層線路﹕﹕ 裁板前處理壓干膜曝光顯影蝕銅去膜AOI檢驗PCB制造流程(1)壓板壓板﹕﹕ 氧化鉚釘疊板壓合打靶切型磨邊鑽孔鑽孔﹕﹕ 上PIN機械鑽孔        雷射鑽孔雷射鑽孔﹕﹕雷射鑽孔電鍍電鍍﹕﹕Desmear  PTH（化學銅） 電鍍銅（孔銅、面銅）外層線路（外層線路（1））﹕﹕前處理  壓干膜 曝光 顯影Mitac China ConfidentialMitac China Confidential外層線路（外層線路（2））﹕﹕電鍍銅（Pattern）電鍍錫去膜蝕銅剝錫AOI檢驗PCB制造流程（2）綠漆（綠漆（S/M)﹕﹕前處理  CC2   曝光  顯影  後烘烤噴錫噴錫(HASL)﹕﹕ 前處理  垂直噴錫   後續處理  （X-Ray 錫厚量測）印字（印字（S/S)﹕﹕ 全自動網板印字  UV烘烤塞孔塞孔﹕﹕手動網板印刷塞孔  烘烤Mitac China ConfidentialMitac China Confidential成形成形﹕﹕切外形切外形  V-cut 等   清洗   測孔機測孔PCB制造流程（3）目視檢驗目視檢驗﹕﹕100%目視檢驗  OQC抽檢O/S測試測試﹕﹕ 100% 短斷路電性 板翹量測板翹量測﹕﹕ 100%板翹檢驗（大理石平台）包裝包裝﹕﹕小包裝  外包裝Mitac China ConfidentialMitac China ConfidentialMicro Via Design Rule ( HDI)---￿Blind￿via￿Design￿rule￿and￿capability---￿Buried￿via￿Design￿rule￿and￿capabilityMitac China ConfidentialMitac China ConfidentialMINI PRINTERNOTE BOOKPCMCIA CARDPORTABLE TERM.PORT FAXPORT PHONEMOBILE PHONECAMCORDERCOMPACT VCRPORTABLE CDCOMPUTERCOMMUNICATIONCONSUMPTIONTECHNOLOGYDEMANDThinnerLayerMoreLayerHigherDensityHDI PROCESSThin DielectricCoatingFlex-RigidCombinationBuried & BlindVia TechnologyVia On PadTechnologyELECTRONIC PRODUCTDEMANDFUNCTIONSMoreFunctionBetterQualityComplexUnionAPPEARANCESmallerLighterThinner Why we need HDI processWhy we need HDI process Mitac China ConfidentialMitac China ConfidentialBAC. Dimension on Micro via(L1L2)ItemDescriptionPreferred DimensionCapability DimensionAMicro Via Diameter4~10 4 ~10BCapture PadA+10 A+8 (Cpk: 1.00)CTarget PadA+12A+10.5 ( Cpk :1.00)  Unit： milMitac China ConfidentialMitac China ConfidentialDBFECOuter layer(1+N+1)N ItemPreferred DimensionBBuried PTH Inner Layer (N) land DiameterA + 10CBuried PTH Outer Layer (N) land DiameterA + 8DPTH Outer Layer (1+N+1) land DiameterA + 8EPTH Outer Layer (N) land DiameterA + 10FPTH Inner Layer (N) land DiameterA + 12“A” = Drill diameter ; * unit : milDimension on Buried via and PTH Stack-up(1+N+1)Mitac China ConfidentialMitac China ConfidentialADUnit：： (mil)Laser Drill & Aspect Ratio The Maximum aspect ratio(D/A) of Micro Via is 0.8The Preferred aspect ratio ( D/A) of Micro Via is 0.6 A=4A=5A=6A=7A=8D(Max.) 3.24 4.85.66.4D( Pre.)2.433.64.24.8Mitac China ConfidentialMitac China ConfidentialBenefit of HDI Process•Trace capability of 6L which apply HDI may be equivalent to traditional 10L PTH board. 1.Reduce layer count- Cost down2.Solution of dense pad requirement3.Solution of dense trace requirement Mitac China ConfidentialMitac China Confidential疊板設計盲埋孔層:        依雷射單面向板中心層打孔之特性,孔口是朝外,而孔底則為朝內. 故所謂之盲埋孔層盲埋孔層即為孔口孔口所在之層. 疊板層數﹕       中間FR4的一般PCB層數M加上N次RCC壓合的總層數為﹕M+2N層Mitac China ConfidentialMitac China ConfidentialHDIHDI產品製作流程示意圖產品製作流程示意圖壓合壓合Mitac China ConfidentialMitac China Confidential發料Issue material內層線路Inner layer黑化Black oxide壓板MLB Lam.鑽孔Drilling除膠渣Desmear化學銅（PTH) Electricless Cu埋孔塞孔Buried Via Plugs全板電鍍PNL plate線路電鍍Pat. plate線路蝕刻Etching外層檢驗Outer Layer AOI暫存倉Temporary StockHDI (有埋孔））內層板一般PCB制作流程外層干膜Dry filmHDIHDI（有埋孔）產品製作流程（有埋孔）產品製作流程（有埋孔）產品製作流程（有埋孔）產品製作流程(1)(1)Mitac China ConfidentialMitac China Confidential黑化Black oxideRCC壓板 RCC Lam.鑽孔Drilling雷射鑽孔Laser Drill水平黑影Horizontal Shadow線路蝕刻Etching綠漆Solder mask浸金Immersion Gold成型Routing檢查測試OQC/FIT/ O/S包裝PackHDI （（有埋孔））增層板制作流程暫存倉Temporary StockConformal Mask Define水平去膠渣Horizontal Desmear外層干膜Dry film盲孔電鍍Blind Via Plating線路電鍍Pat. plate外層檢驗Outer Layer AOI暫存倉Temporary StockHDIHDI（有埋孔）產品製作流程（有埋孔）產品製作流程（有埋孔）產品製作流程（有埋孔）產品製作流程(2)(2)Mitac China ConfidentialMitac China ConfidentialConformal MaskConformal Mask及及Laser DrillLaser Drill制作原理制作原理CO2 Laser BeamRCCRCCMitac China ConfidentialMitac China ConfidentialConformal Mask 制作流程前處理壓干膜Conformal Mask曝光（兩面各一次）Blue Laser AOI檢驗顯影、蝕銅、去膜連線Mitac China ConfidentialMitac China ConfidentialMechanical PropertiesBuild-Up LayerRCCConvention PPLDP PrepregDimension StabilityPoorGoodBetterWarp & TwistPoorGoodBetterRigidityPoorGoodBetterThickness ControlPoorGoodBetterSurface SmoothPoorGoodBetterDrill abilityBetterPoorGoodDielectric Const.<4.04.54.5Insulation ResistancePoorGoodBetterSummary:-- Increase mechanical strength-- Allow to design circuit with more diversity ( Impedance design, trace, thickness etc.)-- Lower drilling output Comparison for RCC & LDP Mitac China ConfidentialMitac China Confidential水平去膠渣盲孔電鍍制程流程水平黑影盲孔電鍍•Dielectric thickness：：2.4mil•Blind Via diameter：：4 mil•A/R of blind-via：：0.6•Throwing-power：：82%•PS:A/R= Aspect RatioMitac China ConfidentialMitac China Confidential HDI技術發展趨勢與華通策略 市場需求市場需求市場需求市場需求華通策略華通策略華通策略華通策略•輕薄短小•增加LDP技術•新干膜for線路制程技術要求技術要求技術要求技術要求• 多次盲埋孔• 細線路、BGA•高的工作溫度•高功能、高頻• 無鉛產品• 無鹵素產品• 應用高Tg值基材及RCC• 浸金、浸銀• 應用無鹵素基材及無鹵素RCC材料（Halogen Free）•環保Mitac China ConfidentialMitac China ConfidentialPCB Metal FinishTypeAdvantagesDisadvantagesHASL-Lower Cost-Good Solderability & Reliability-Lead-free Concern-Unsuitable for fine pitch-Poor Surface UniformityPreflux-Good Planarity-No discoloration on Cu Surface-Good reliability-Difficult for O/S testing-Causing thermal degradationImmersion Gold-Good Planarity-Good solderability-Luxury appearance-Higher Cost-Reliability concern for fine pitch  mBGAImmersion Gold +Preflux-Good Planarity-Good reliability for find pitch mBGA-Complicated Process for manufacturing-Higher Cost-S/M & D/F leaching concernImmersion Silver-Good Planarity-Good solderability& Reliability-Luxury appearance-Sensitive to S and Cl-Vulnerable from scratch-Inconvenient for handingImmersion Gold +Super solder-Related simple for manufacturing-Better solderability& reliability especially for mBGA-Lead-free Concern-Cost vary with superficial measure of super solder。