NS引线焊接机解决方案.docx

NS引线焊接机解决方案Wire bonders attach a piece of semiconductor die onto its plastic or ceramic packaging. This is a very precision operation where, the package and die must line up to ensure a good electrical contact. Using an image sensor to correctly position the die, the information from the sensor is sent along the LVDS channel to a DSP. The DSP then sends the information to a die positioning table to line up the die and packaging. National offers a variety of precision operational amplifiers and DACs to handle this task. In addition power management, temperature sensors and operator display ensures that this task operates safely and efficiently. Component Highlights*LVDS - high toggle rates allow serialization of large amounts of parallel data for efficient transmission over a single 100 ohm transmission line, with reduced emissions and drastically improved immunity to external interference.*Operational amplifiers - Rail-to-rail input and output amplifiers maximize the signal range.*D/A converter - with high resolution and sampling rates, DACs easily interface with microprocessors and TTL logic.*Ethernet - Ethernet devices consume low power and are available in a wide range of speeds from 10/100 MB/s to 1Gbps1 PowerLP2997LP38691LP386932 LVDSDS92LV1021ADS92LV1023EDS92LV12603 DisplayADCS9888CVH-170ADCS9888CVH-1404 DACDAC081S101CIMKDAC081S101CIMKXDAC081S101CIMM5 AmpLMH6639LMH6642LMH66436 EthernetDP83816AVNG7 Temp SensorLM26LM278 PowerLM25005LM25007LM25010 :4Word版本。