6SMT生产常用英文.ppt

SMT生产常生产常用英文用英文一、部门组织类二、系统文件类三、生产工站类四、零件认识类五、质量管理类六、不良类型类目目 录录DC (Document Center) 资料中心DCC (document control center) 文件管理中心Design Center 设计中心PCC (Product control center) 生产管制中心PMC (Production & Material Control)生产和物料控制PPC (Production Plan Control) 生产计划控制一、部门组织类一、部门组织类SCM (supply chain management) 供应链MC Material Control 物料控制QCC (Quality Control Circle) 品质圈QIT (Quality Improvement Team)质量改善小组MFG (manufacturing) 制造单位Manufacturing Dept = MD 制造部PD (Product Department) 生产部Logistical Dept 物流部Purchasing Dept 采购部Cost Management Dept 经 管Material Control Dept 物 管Personnel Dept 人事部Engineering Standard Dept 工标部Quality Assurance Dept 品保部R&D (Research & Design) 设计开发部Delivery Control Center 交 管Planning Dept 企划部Administration/General Affairs Dept 总务部PM (project management) 专案管控LAB (Laboratory) 实验室QE (Quality Engineering) 质量工程(部)QA(Quality Assurance) 质量保证(处)QC (Quality Control) 质量管理(课)IE (Industrial Engineering) 工业工程ME (manufacture engineering) 制造工程PE (PRODUCTS ENGINEERING) 产品工程TE (TEST ENGINEERING) 测试工程EE (ELECTRONICS ENGINEERING)电子工程ISO (International Standard Organization)国际标准化组织ES (Engineering Standard)　　 工程标准IWS (International Workman Standard)工艺标准GS (General Specification) 一般规格SIP (Standard Inspection Procedure) 标准检验规范SOP (Standard Operation Procedure)制造作业规范二、系统文件类二、系统文件类IS (Inspection Specification) 成品检验规范POP (packing operation procedure) 包装操作规范BOM (Bill Of Material) 物料清单PS (Package Specification) 包装规范SPEC (Specification) 规格DWG (Drawing) 图面SWR (Special Work Request) 特殊工作需求APP (Approve) 核准,认可,承认CHK (Check) 确认ECO (Engineering Change Order) 工程改动要求PCN (Process Change Notice) 工序改动通知PMP (Product Management Plan) 生产管制计划CAR (Correction Action Report) 改善报告TPM (Total Production Maintenance) 全面生产保养MRP (Material Requirement Planning) 物料需计划OS (Operation System) 操作系统SSQA (standardized supplier quality audit)合格供货商质量评估AVL (acceptable vendor list)允许的供货商清单PDCS (process defect contact sheet)制程异常联络单E(D)CN (Engineering(Design) change notice)工程(设计)变更通知KPI (Key performance index)主要绩效指标Computer 计算机Consumer Electronics 消费性电子产品Communication 通讯类电子产品OEM (Original Equipment Manufacture)原设备制造PCPersonal Computer 个人计算机5W1H (When, Where, Who, What, Why, How to)三、生产工站类三、生产工站类6M Man, Machine, Material, Method,Measurement, Message4MTH (Man, Material, Money, Method, Time, How) 人力,物力,财务,技术,时间(资源)CP (capability index) 能力指数CPK (capability process index) 制程能力参数FMEA (failure model effectiveness analysis) 失效模式分析SMT (surface mount technology)表面贴装技朮PTH (Plate Through hole)镀层穿孔(手插件)PCBA (Printing circuit board Assembly)组装印刷电路板PO (Purchasing Order) 采购订单MO (Manufacture Order) 生产单PC# (product code) 产品编码MM# (material master number) 主件料号AA# (altered assembly number) 成品料号PBA# (printed board assembly number)半成品料号PPID (Product part Identification) 产品料号识别码L/N(Lot Number) 批号P/N(Part Number) 料号N/A(Not Applicable) 不适用S/N (serial number) 序列号CHK (check) 检查SEPC (specification) 规格ID: (Identify) 鉴别号码Barcode 条形码barcode scanner 条形码扫描仪WDR (Weekly Delivery Requirement)周出货要求PPM (Percent Per Million) 百万分之一PCs(Pieces) 个(根,块等)PRS(Pairs) 双(对等)CTN(Carton) 卡通箱PAL(Pallet/skid) 栈板D/C(Date Code) 生产日期码ID/C(Identification Code) (供货商)识别码QTY(Quantity) 数量I/O(input/output) 输入/输出Flux 助焊剂Cleaning solvent 清洁剂Cleaning paper 擦拭纸Hand solder 烙 铁Solder Paste 锡膏 Feeder 供料器Stencil 钢网 Nozzle 吸嘴PAD 焊垫 Squeegee 刮刀Pinter Machine 锡膏印刷机器Buffer Loader 收板机Material 物料Mounting Machine 贴片机器REFLOW Machine 回流焊炉Profile 回焊温度曲线图AOI (automatic optical inspection)自动光学检测W/S (wave solder) 波峰焊ICT (in circuit test) 线路测试IFT (integrate function test) 功能测试FCT (Function check Test) 功能测试SMD (Surface Mounting Device) 贴装设备BGA Rework Station BGA维修站MSD (moisture sensitive device) 湿度敏感组件SMC (Surface Mount Component) 表面贴装组件SMD (Surface Mount Device) 表面帖装元器件Leads 组件脚Terminations 端头脚件Passive Component 无源器件Active Component 有源器件四、零件认识类四、零件认识类BIOS: (Basic Input Output System)基本输入输出系统CMOS: (Complementary Metal-Oxide-Semiconductor Transistor)互补型金属氧化物半导体Core 铁芯CPU: (Central Processing Unit) 中央处理器DMA: (Direct Memory Access) 直接内存存取IC: (Integrated Circuit) 集成电路SPS (Switching power supply) 电源箱AGP (Accelerated Graphic Port) 加速图形端口FDD (Floppy Disk Drive) 软式磁盘机HDD (Hard Disk Drive) 硬盘驱动器North Bridge 北桥South Bridge 南桥IDE: (Integrated Drive Electronics)集成电路设备, 智能磁盘设备LAN: (Local Area Network)网络, 局域网, 本地网MOSFET: (Metal-Oxide Semiconductor FieldEffect Transistor)金属氧化物半导体场效应晶体管PCI: (Peripheral Component Extended Interface)周边组件扩展接口SCSI: (Small Computer System Interface)小计算机系统的界面USB: (Universal Serial Bus) 通用串行总线SDRAM: (Synchronous Dynamic Random Access Memory) 同步动态随机存取存储器KEYBOARD 键盘 CABLE LINE 排线HEADER 头/排 针 JACK 插头CABLE 电缆/排线 TUNER 调频器–Pin = I/O (Input / Output) 输入/输出PCBPCB Printed Circuit BoardPrinted Circuit Board 印刷电路板印刷电路板Network resistorNetwork resistor排阻排阻ResistorResistor电阻电阻CapacitorCapacitor电容电容Network Network capacitorcapacitor排容排容TANTALUM TANTALUM CAPACITORCAPACITOR钽质电容器钽质电容器INDUCTORINDUCTOR电感电感FuseFuse保险丝保险丝Light-emitting Light-emitting diodediode发光二极管发光二极管晶体管晶体管transistortransistorCrystal(石英晶体)Diode(二极管)Switch(开关)MELF(金属电极表面连接组件)Quad flat Quad flat packagepackageQFPQFP四方扁平封四方扁平封装装Small outlineSmall outlinePackagePackageSop Sop 小轮廓封装小轮廓封装PLCCPLCCPlastic Leaded chip Plastic Leaded chip carriercarrier塑料芯片载体塑料芯片载体BGABGABall grid arrayBall grid array球形陈列封装球形陈列封装QC (quality control) 品质管理人员FQC (final quality control) 终点质量管理人员IPQC (in process quality control)制程中的质量管理人员OQC (output quality control)最终出货质量管理人员IQC (incoming quality control)进料质量管理人员TQC (total quality control) 全面质量管理PQC (passage quality control) 段检人员五、质量管理类五、质量管理类QA (quality assurance) 质量保证人员OQA (output quality assurance)出货质量保证人员QE (quality engineering) 质量工程人员QPA (Quality Process Audit) 制程品质稽核OQM (output quality measure)出货质量检验SQA (Strategy Quality Assurance) 策略质量保证DQA (Design Quality Assurance) 设计质量保证MQA (Manufacture Quality Assurance)制造质量保证SSQA (Sales and service Quality Assurance)销售及服务质量保证SPC (Statistical Process Control) 统计制程管制SQC (Statistical Quality Control) 统计质量管理GRR (Gauge Reproductiveness & Repeatability)量具之再制性及重测性判断量可靠与否8SClassification 整理 (sorting, organization)-seiriRegulation 整顿 (arrangement, tidiness)-seitonCleanliness 清扫 (sweeping, purity)-seisoConservation 清洁 (cleaning, cleanliness)-seiktsuCulture 教养 (discipline)-shitsukeSave 节约Safety 安全Security 保密PDCA (Plan Do Check Action)计划 执行 检查 总结FAI(first article inspection)新品首件检查FAA(first article assurance) 首件确认AQL(Acceptable Quality Level) 允收质量水平S/S(Sample size) 抽样检验样本大小FPIR (First Piece Inspection Report)首件检查报告ACC(Accept) 允收REJ(Reject) 拒收CR(Critical) 极严重的MAJ(Major) 主要的MIN(Minor) 轻微的Q/R/S (Quality/Reliability/Service) 质量/可靠度/服务ZD(Zero Defect) 零缺点NG(Not Good) 不行,不合格QI (Quality Improvement) 质量改善QP (Quality Policy) 目标方针TQM (Total Quality Management) 全面质量管理RMA (Return Material Audit) 退料认可LRR (Lot Reject Rate) 批退率NDF (no defect found) 误判7QCTools(7 Quality Control Tools) 品管七大手法ESD (Electric Static Discharge)静电释放DPPM(Defective Percent Per Million)每百万单位的产品不合格率Misalignment 偏 位Tombstone 墓 碑Missing parts 缺 件Insufficient solder 少 锡Solder ball 锡 珠Short bridge 短 路Open 空 焊Part damaged 零件破损Cool solder 冷 焊Wrong parts 错 件六、不良类型类六、不良类型类偏位偏位偏位偏位 misalignmentmisalignment多锡Excessive solder少锡insufficient solder墓碑墓碑Tombstone翘脚翘脚Lead raised空焊空焊﹐﹐假焊假焊Open翻身翻身﹐﹐反白反白reverse连锡连锡Short bridge锡珠锡珠Solder ball破损破损Broken。