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贴片灯珠1206-鑫光硕1206橙光贴片LED灯珠-规格书参数.docx

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    • 承 认 书SPECIFICATION FOR APPROVAL客 户Customer:客 户 品 号Customer P/N:鑫光硕品号Xgs Model:规 格Specification :XGS-PB3216AM-02SMD1206橙光普亮 20MA制 作Prepared By: 李 忠审 核Checked By:Customer Confirmation 客户确认采购部Pur Dept By品质部QA Dept By工程部Eng Dept By深圳市鑫光硕科技有限公司SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD公司地址:广东省深圳市宝安区沙井万丰村前路31号8楼 一厂地址:广东省深圳市龙岗区嶂背创业二路18-1号二厂地址:广东省东莞市石排镇庙边王村沙迳工业区Tel: 13798585378 :2373888283Website :Http:// E-mail:xz@· Customer:Technical Data Sheet PN: XGS-PB3216AM-02 For: IF=20mAContents 1.Features 2.Applications3.Package dimensions 4.Absolute maximum rating5.Electrical optical characteristics 6.BIN range7.Package label 8.Soldering pad dimensions 9.Soldering conditions10. Package tape specifications11. Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions14.NoteCustomer confirmApproved byChecked byIssued byPart No.XGS-PB3216AM-02Emitted ColorHigh Super RedLen's ColorWater ClearChip MaterialAlGaInP----◆ Features:Compatible with automatic placement equipment Compatible with reflow solder processLow power consumption and wide viewing angleThis product doesn’t contain restriction Substance, comply ROHS standard.◆ Applications:Automotive and TelecommunicationFlat backlight for LCD ,switch and symbol in telephone and fax General use for indicators◆ Package Dimensions:Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT ResinPage 4 of 8◆ Absolute Maximum Rating (Ta=25℃)ParameterSymbolMax.UnitPower DissipationPD62MwPulse Forward CurrentIFP100mADC Forward CurrentIF25mAReverse VoltageVR5VOperating Temperature RangeTopr-40℃~85℃℃Storage Temperature RangeTstg-40℃~100℃℃* IFP condition: pulse width ≤1ms ,duty cycle ≤1/10◆ Electrical Optical Characteristics(Ta=25℃)ParameterSymbolMinTyp.Max.UnitTestConditionLuminous IntensityIV50--200mcdIF =20mAForward VoltageVF--1.92.2VIF =20mAReverse CurrentIR----2uAVR=7VDominant Wavelengthλd--600610nmIF=20mASpectral Line Half WidthΔλ--25--nmIF=20mAViewing Angle2θ1/2--120--Deg.IF =20mANotes: 1.Tolerance of Luminous Intensity ±10% 2.Tolerance of Dominant Wavelength ±2nm3. Tolerance of Forward Voltage ±0.05V4. Luminous Intensity is measured by XGS’s equipment on bare chips◆ Soldering Pad Dimensions:◆ Soldering Conditions (Maximum allowable soldering conditions)Reflow soldering profileTemperatureTime• Reflow soldering should not be done more than two times.• Do not stress its resin while soldering.• After soldering,do not warp the circuit board.φ13± 0.2φ180 φ60◆ Package Tape Specifications: ( 3000 pcs/Reel)1.751.85_ 0.23.58.0+Polarity225250605 Reels in one Box 10 Boxes in one Carton◆ Typical Electro-Optical Characteristics Curves:Page 5 of 8Forward Current Vs Ambient Temperature50Forward Current(mA)403020100200Relative Luminosity(%)1751501251007550250Forward Current Vs Relative LuminosityTa=25℃0 2040 6080 1000 10 2030 40 50Ambient Temperature Ta (° C) Forward Current (mA)◆ Reliability(1) Test Items and ConditionsNOTest ItemTest ConditionsSampleAc/Re1Temperature Cycle-40±5℃→25±5℃→100±5℃→25±5℃(30min,5min,30min,5min) 100 Cycles200/12High Temperature StorageTa:100±5℃Test time=1000HRS(-24HRS,+72HRS)200/13High Temperature AndHigh Humidity WorkingTa:85±5℃,RH:85±5%,IF=20mA Test time=500HRS(-24HRS,+72HRS)200/14Low Temperature StorageTa:-40±5℃Test time=1000HRS(-24HRS,+72HRS)200/15Operating Life TestConnect with a power IF=20mA Ta=Under room temperatureTest time=1000HRS(-24HRS,+72HRS)200/16Thermal Shock-40±5℃→100±5℃(15min,15min) 100 Cycles200/17IR-Reflow Pb-Free Process① 80 ℃② 100 ℃③ 120 ℃④ 160 ℃⑤ 170℃⑥235℃⑦270℃⑧255℃, 60cm/min,2 times200/1(2) Criteria of judging the damageItemSymbolTest conditionCriteria for judgementMin.Max.Forward voltageVFIF=Test Current/U.S.L*1.1Reverse currentIRVR=5V/15uALuminousintensityIVIF=Test CurrentL.S.L*0.7/Wave lengthλD/λPIF=Test Current/U.S.L±2nmAppearance/View checkNo mechanical damage* U.S.L: Upper standard level L.S.L: Lower standard levelPage 7 of 8◆ Cautions1、PackageWhen moisture is absorbed into the package。

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