PCB专业词汇.doc

基础知识：印制电路专业词汇中英文对照一、综合词汇印制电路：printedcircuit2^ 印制线路：printedwiring3、 E卩制板:printedboard4、 E卩制板电路:printedcircuitboard(PCB)5^ 印制线路板：printedwiringboard(PWB)6^ 印制元件：printedcomponent7^ 印制接点:printedcontact8、 E卩制板装配:printedboardassembly9、 板：board10x 单面印制板:single-sidedprintedboard(SSB)11> 双面印制板:double-sidedprintedboard(DSB)12、 多层印制板:mulitlayerprintedboard(MLB)13、 多层印制电路板:mulitlayerprintedcircuitboard14、 多层印制线路板：mulitlayerpritedwiringboard15、 刚性印制板:rigidprintedboard16、 刚性单面印制板:rigidsingle-sidedprintedborad17、 刚性双面印制板:rigiddouble-sidedprintedborad18> 刚性多层印制板:rigidmultilayerprintedboard19、挠性多层印制板:flexiblemultilayerprintedboard20、挠性印制板：flexibleprintedboard21> 挠性单面印制板:flexiblesingle-sidedprintedboard22、 挠性双面印制板:flexibledouble-sidedprintedboard23、 挠性印制电路:flexibleprintedcircuit(FPC)24挠性印制线路:flexibleprintedwiring25、刚性印制板:flex-rigidprintedboardjigid-flexprintedboard26> 刚性双面印制板:flex-rigiddouble-sidedprintedboard/igid-flexdouble-sidedprinted27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28> 齐平印制板：flushprintedboard29> 金属芯卬制板：metalcoreprintedboard30、金属基卬制板：metalbaseprintedboard31> 多重布线卬制板：mulit-wiringprintedboard32、 陶瓷印制板：ceramicsubstrateprintedboard33、 导电胶印制板：electroconductivepasteprintedboard34> 模幫电路板：moldedcircuitboard35、 模压卬制板：stampedprintedwiringboard36、 顺序层压多层印制板:sequentially-laminatedmulitlayer37、 散线印制板:discretewiringboard38、 微线印制板：microwireboard39> 枳层卬制板：buile-upprintedboard40、积层多层印制板:build-upmulitlayerprintedboard(BUM) 41、积层挠卬制板：build-upflexibleprintedboard42、表面层合电路板:surfacelaminarcircuit(SLC)43>埋入凸块连卬制板：B2itprintedboard44多层膜基板：multi-layeredfilmsubstrate(MFS)45、层间全内导通多层印制板:ALIVHmultilayerprintedboard46> 载芯片板:chiponboard(COB)47> 埋电阻板：buriedresistanceboard48> 母板：motherboard49、子板：daughterboard50> 背板：backplane51^ 裸板：bareboard52> 键盘板夹心板：copper-invar-copperboard53、 动态挠性板:dynamicflexboard54、 静态挠性板：staticflexboard55、 可断拼板：break-awayplanel56、 电缆:cable57、 挠性扁平电缆：flexibleflatcable(FFC)58> 薄膜开关：membranetch59、混合电路：hybridcircuit60> 厚膜:thickfilm61> 厚膜电路:thickfilmcircuit62、薄膜:thinfilm 63> 薄膜混合电路：thinfilmhybridcircuit互连：interconnection导线：conductortraceline齐平导线：flushconductor传输线：transmissionline跨交：crossover板边插头:edge-boardc on tact增强板：stiffener基底：substrate基板面：realestate导线面:conductorside元件而：componentside焊接面:solderside印制：printing网格：grid图形：pattern导电图形：conductivepattern卜导I’图形：norvconductivepattern字符：leg end标志：mark二、基材:1> 基材：basematerial2、层压板：laminate3> 覆金属箔基材：metal-cladbadematerial4、 覆铜箔层压板:copper-cladlaminate(CCL)5、 单-而覆铜箔层压板：single-sidedcopper-cladlaminate6、 双面覆铜箔层压板:double-sidedcopper-cladlaminate7、 复合层压板：compositelaminate8、 薄层压板:thin laminate9、 金属芯覆铜箔层压板：metalcorecopper-cladlaminate10金属基覆铜层压板：metalbasecopper・cladlaminate挠性覆铜箔绝缘薄膜:flexiblecopper-claddielectricfilm12、 基体材料：basismaterial13、 预浸材料：prepreg14> 粘结片:bondingsheet15、 预浸粘结片：preimpregnatedbondingsheer16、 环氧玻璃基板：epoxyglasssubstrate17、 加成法用层压板:laminateforadditiveprocess18、 预制内层覆箔板:masslaminationpanel19> 内层芯板：corematerial20催化板材：catalyzedboard,coatedcatalyzedlaminate21^ 涂胶催化层压板：adhesive-coatedcatalyzedlaminate22^ 涂胶无催层丿1｛板：adhesive-coateduncatalyzedlaminate23、粘结层:bondinglayer24> 粘结膜:filmadhesive25> 涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm26、 无支撑胶粘剂膜：unsupportedadhesivefilm27、 覆 盖层:coverlayer(coverlay)28、 增强板材:stiffenermaterial29、 铜箔面:copper-cladsurface30、 去铜箔面：foilremovalsurface31^ 层压板血:uncladlaminatesurface32^ 基膜|衍：basefilmsurface33、 胶粘剂|fli： adhesivefaec34、 原始光洁面:platefinish35、 粗面:mattfinish36^ 纵向：lengthwisedirection37、模向：crosswisedirection38> 剪切板：cuttosizepanel39酚醛纸质覆铜箔板:phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)40> 环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)41、 环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates42、 环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlami nates43、 环氧玻璃布玻璃纤维复合覆铜箔板：epoxidenonwove n/wovenglassreinforcedcopper-clad laminates44、 聚酯玻璃布覆铜箔板:ployesterwovenglassfabriccopper-cladlaminates45. 聚酰亚胺玻璃布覆铜箔板:polyimidewovenglassfabriccopper-cladlaminates46、双马來酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazi ne/epoxidewo ven glassfabriccopper-cladlamimates47环氧合成纤维布覆铜箔板:epoxidesyntheticfiberfabriccopper-cladlaminates48> 聚四乙烯玻璃纤维覆铜箔板：teflon/fiberglasscopper・cladlaminates49> 超薄型层压板:ultrathinlaminate50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates51>紫外线阻扌肖型覆铜箔板：UVblockingcoppeucladlaminates三、基材的材料A 阶树脂：A-stageresin2^ B 阶树脂：B-stageresin3、 C 阶树脂：C-stageresin4、 环氧树脂:epoxyresin5^ 酚醛树脂：phenolicresin6、聚酯树脂:polyesterresin7^聚酰亚胺树脂:polyimideresin8、双马来酰亚胺三嗪树脂：bismaleimide-triazineresin9^丙烯酸树脂:acrylicresin10三聚氤胺中醛树脂：melamineformaldehyderesin11> 多官能环氧树脂:polyfunctionalepoxyresin12、澡化环氧树脂：brominatedepoxyresin13 > 环氧酚醛:epoxynovolac14氟树脂:fluroresin15> 硅树脂:siliconeresin16、 硅烷：silane17、 聚合物：polymer18> 无定形聚合物:amorphouspoly。