SMD 1204橙黄绿双色贴片LED灯珠参数规格书
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SMD 1204橙黄绿双色贴片LED灯珠参数规格书
承认书SPECIFICATION FOR APPROVAL客户Customer:客 户 品 号Customer P/N:鑫光硕品号Xgs Model:规格Specification :制作XGS-PB3010AMAG-04SMD 1204橙黄绿双色 20MAPrepared By:李忠审核Checked By:Customer Confirmation 客户确认采购部Pur Dept By品质部QA Dept By工程部Eng Dept By深圳市鑫光硕科技有限公司SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD公司地址:广东省深圳市宝安区沙井万丰村前路31号8楼 一厂地址:广东省深圳市龙岗区嶂背创业二路18-1号二厂地址:广东省东莞市石排镇庙边王村沙迳工业区Tel: 13798585378 QQ:2373888283Website :Http:/www.xgsled.cn E-mail:xzxgsled.cn· Customer:Technical Data SheetPN: XGS-PB3010AMAG-04 For: IF=20mAContents 1.Features 2.Applications3. Package dimensions4. Absolute maximum rating 5.Electrical optical characteristics 6.BIN range7.Package label 8.Soldering pad dimensions 9.Soldering conditions10. Package tape specifications11. Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions14.NoteCustomer confirmApproved byChecked byIssued byPart No.XGS-PB3010AMAG-04Emitted ColorAmberGreenLen'sColorWater ClearChip MaterialAlGaInPAlGaInP- - Features:Compatible with automatic placement equipment Compatible with reflow solder processLow power consumption and wide viewing angleThis product doesnt contain restriction Substance, comply ROHS standard. Applications:Automotive and TelecommunicationFlat backlight for LCD ,switch and symbol in telephone and fax General use for indicators Package Dimensions:Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT ResinPage 1 of 8 Absolute Maximum Rating(Ta=25)ParameterSymbolValueUnitAMAGPower DissipationPM8080MwPulse Forward CurrentIFP30mADCForward CurrentIF20mAReverse VoltageVR5VOperating Temperature RangeTopr-40+80Storage Temperature RangeTstg-40+85aIFP condition: pulse width1ms ,duty cycle1/10ParameterSymbolMinTyp.Max.UnitTest ConditionLuminous IntensityIVAmber80160-mcdIF =20mAGreen2050-Forward VoltageVFAmber1.82.02.4VIF =20mAGreen1.82.02.4Reverse CurrentIRAmber-10uAVR=5VGreen-10Dominant WavelengthdAmber600605-nmIF=20mAGreen565570-Viewing Angle21/2Amber-120-Deg.IF =20mAGreen-120- Electrical Optical Characteristics(Ta=25)Notes: 1.Tolerance of Luminous Intensity±10% 2.Tolerance of Dominant Wavelength±2nm3. Tolerance of Forward Voltage±0.05V4. Luminous Intensity is measured by XGSs equipment on bare chipsPage 2 of 8 Soldering Pad Dimensions: Soldering Conditions(Maximum allowable soldering conditions)Reflow soldering profileTemperature<Pb-free solder> 3/sec. 260Max. 10sec.Max.210Pre-heating 120160 3/sec.-4/sec.60120sec. 120se.c.Max.Time Reflow soldering should not be done more than two times. Do not stress its resin while soldering. After soldering,do not warp the circuit board.Page 3 of 8 Package Tape Specifications: (4000 pcs/Reel)Feeding,DirectionDimensions of Reel ( Unit:mm) Feeding DirectionA42Dimensions of Tape (Unit:mm)A31Arrangement of Tape(Unit:mm)Page 4 of 8 Typical Electro-Optical Characteristics Curves:Page 8 of 8Relative Luminous Intensity Vs.WavelenghtForward Current Vs.Forward VoltageRelative Luminous Intensity (%)100755025Ta=25°CTa=25°CMAAGAMAG50Forward Current (mA)403020100540560580600620Wavelenght(nm)01.01.52.02.53.03.5Forward Voltage(V) Reliability(1) Test Items and ConditionsNOTest ItemTest ConditionsSampleAc/Re1Temperature Cycle-40±525±5100±525±5(30min,5min,30min,5min) 100 Cycles200/12High Temperature StorageTa:100±5Test time=1000HRS(-24HRS,+72HRS)200/13High Temperature AndHigh Humidity WorkingTa:85±5,RH:85±5%,IF=20 Test time=500HRS(-24HRS,+72HRS)200/14Low Temperature StorageTa:-40±5Test time=1000HRS(-24HRS,+72HRS)200/15Operating Life TestConnect with a power IF=20mA Ta=Under room temperatureTest time=1000HRS(-24HRS,+72HRS)200/16Thermal Shock-40±5100±5(15min,15min) 100 Cycles200/17IR-Reflow Pb-Free Process 80100120 160170235270255,60cm/min,2 times200/1