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SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROWS SOLUTIONS 2 Thixotropic low-temperature gel, specifi ed ion content Long pot life, specifi ed ion content Thixotropic, specifi ed ion content, low bleeding, controlled volatility Opaque, distinct tackiness, good damping properties, specifi ed ion content High transparency, pressure- sensitive primerless adhesion, good damping properties High transparency, pressure- sensitive primerless adhesion, good damping properties Very soft Distinct tackiness, good damping properties High transparency, distinct tackiness, good damping properties Transparent, rapid curing, good damping properties, low risk of inhibition Tough silicone gel 2-Part Addition-Curing SEMICOSIL 900 LT SEMICOSIL 905 SEMICOSIL 911 SEMICOSIL 913 SEMICOSIL 921 SEMICOSIL 9212 WACKER SilGel 610 WACKER SilGel 611 white WACKER SilGel 612 WACKER SilGel 612 EH WACKER SilGel 614 Transparent Brownish Transparent Black Transparent Transparent Transparent White Transparent Brownish Transparent 1.00 0.96 1.00 0.97 0.97 0.97 0.96 0.96 0.96 0.96 0.96 15,000 200 8,500 1,000 700 700 7,000 1,000 1,000 1,000 7,000 1 : 1 1 : 1 1 : 1 1 : 1 1 : 1 1 : 1 1 : 1 1 : 1 1 : 1 1 : 1 1 : 1 2 h 6 h 1 h 45 min 90 min 8 h 1 h 50 min 2.5 h 30 min 1 h 12 h/23 C or 10 min/120 C 48 h/23 C or 30 min/120 C 5 min/100 C or 2 min/130 C 2 h/23 C or 2 min/120 C 24 h/25 C or 15 min/125 C 24 h/25 C or 15 min/125 C 4 h/23 C or 5 min/120 C 6 h/23 C or 10 min/120 C 8 h/23 C or 10 min/120 C 2 h/23 C or 3 min/120 C 4 h/23 C or 5 min/120 C PropertiesColorDensity Mixing ratio Pot life / skin-over timeCuring timeProductViscosity mPas These figures are intended as a guide and should not be used in preparing product specifications. A SUMMARY OF THE PROPERTIES OF SILICONE GELS g/cm3 3 2-Part Addition-Curing 70 70 60 70 a. A. a. A. 90 30 75 30 30 3E04 3E04 3E04 3E04 3E04 1E04 3E04 3E04 3E04 3E04 3E04 23 23 23 23 22 22 23 23 23 23 23 3.0 2.7 2.7 3.0 2.5 2.5 2.8 2.8 2.7 2.8 2.8 5E03 1E03 1E03 6E03 1E03 1E03 1E03 1E03 1E03 1E03 1E03 1E +16 1E +16 1E +16 1E +16 1E +14 1E +14 1E +16 1E +16 1E +16 1E +16 1E +16 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Penetration CTE Dielectric strength Dielectric constant Dissipation factor Volume resistivity Thermal conductivityShelf lifeAvailability 12 12 12 6 12 12 12 12 12 12 12 On request On request On request On request On request On request On request On request Yes On request On request mm/10m/mKkV/mm cmW/mKMonths SEMICOSIL, ELASTOSIL and WACKER SilGel are registered trademarks of Wacker Chemie AG. Wacker Chemie AG is certifi ed to EN ISO 9001 and EN 14001. The Elastomers Business Unit at Wacker Chemie AG s WACKER SILICONES Business Division is certifi ed to ISO/TS 16949:2002. 4 Thixotropic, heat-curing, specifi ed ion content, low bleeding, controlled volatility UV-fl uorescent version of SEM. 924, low viscosity vs. SEM. 924 Ready-to-use, one-part curing, good damping properties Very low viscosity, specifi ed ion content Fluorosilicone gel, thixotropic, curing, specifi ed ion content 1-Part Addition-Curing SEMICOSIL 924 SEMICOSIL 9242 SEMICOSIL 925 SEMICOSIL 926 SEMICOSIL 927 F Translucent Translucent Transparent Translucent Translucent 1.00 0.98 0.97 0.96 1.27 35,000 20,000 700 150 6,000 n. a. n. a. n. a. n. a. n. a. n. a. n. a. n. a. n. a. n. a. 4 h/100 C or 10 min/150 C 4 h/100 C or 10 min/150 C 35 min/100 C or 3 min/150 C 4 h/100 C or 10 min/150 C 4 h/100 C or 30 min/150 C PropertiesColorDensity Mixing ratio Pot life / skin-over timeCuring timeProductViscosity g/cm3mPas These figures are intended as a guide and should not be used in preparing product specifications. 5 1-Part Addition-Curing 50 50 60 60 60 3E04 3E04 3E04 3E04 3E04 23 23 23 23 23 2.7 2.7 n. a. 2.7 n. a. 1E03 1E03 n. a. 1E03 n. a. 1E + 16 1E + 16 1E + 16 1E + 16 1E + 16 0.2 0.2 0.2 0.2 0.2 3 3 3 3 3 On request On request On request On request On request mm/10m/mKkV/mmcmW/mKMonths Penetration CTE Dielectric strength Dielectric constant Dissipation factor Volume resistivity Thermal conductivityShelf lifeAvailability 6 General-purpose potting compounds General-purpose potting compounds General-purpose potting compounds General-purpose potting compounds Excellent heat resistance General-purpose potting compounds, highly transparent General-purpose potting compounds, good heat resistance Highly transparent General-purpose potting compounds, fl ame-retardant, good heat resistance General-purpose potting compounds, suitable for the manufacture of technical molded parts, excellent mechanical properties Potting compound, suitable for injection molding General-purpose potting compounds, suitable for the manufacture of technical molded parts, excellent mechanical properties Suitable for the manufacture of technical molded parts, good mechanical properties Excellent thermal conductivity Heat-curing, very low v