ti公司芯片封装手册
6页1、Packaging Solutions Texas Instruments Analog & Logic Packaging Solutions DataPin countPackage typeTI package designatorBody length (mm) Min MaxBody width (mm)Min MaxLead width (mm) Min MaxPitch (mm) NomLead foot (mm) Min MaxPkg width (mm) Min MaxHeight (mm) MaxSurface Mount Product2PowerFLEXKTP5.916.176.026.270.630.792.290.941.199.429.682.03 3PFM/DPAKKVU6.56.75.976.220.760.892.291.41.789.810.412.39 3PFM/TO-263/DDPAKKTT9.6510.678.389.650.660.912.541.782.7914.615.884.83 3PowerFLEXKTE9.279.527.878.
2、130.630.792.540.791.0410.4110.672.03 3SOP/SOT-23DBZ2.83.041.21.40.370.510.950.40.62.12.641.12 3SOT/SOT-89PK4.44.62.42.60.360.531.50.81.23.944.251.6 3TO-220KC9.6510.678.389.020.710.892.54-26.9231.244.7 3TO-220KCS9.6510.678.389.020.710.892.54-26.9231.244.7 3TO-92LP4.445.214.325.340.410.561.27-4.445.2125.34 4DSLGA (PicoStar)YFM0.740.80.740.80.180.220.4-0.740.80.15 4SOP/SOT-223DCY6.36.73.33.70.660.842.30.75-6.77.31.8 4SOT-143DZD2.83.041.21.40.30.51.920.20.62.12.641.22 4WCSP/NanoStarYFP0.740.80.740.8
3、0.210.250.4-0.740.80.5 4WCSP/NanoStarYZV0.850.950.850.950.20.250.5-0.850.950.5 5PFMKV9.6510.678.389.250.751.021.7-24.6425.154.7 5PFM/TO-263/DDPAKKTT9.6510.678.29.650.660.911.71.782.7914.615.884.83 5PowerFLEXKTG9.279.527.878.130.630.791.70.791.0410.4110.672.03 5SOP/SC-70DCK1.852.151.11.40.150.30.650.260.461.82.41.1 5SOP/SOT-23DBV2.831.51.70.30.50.950.350.552.631.45 5SOTDRL1.51.71.11.30.150.250.50.20.41.51.70.6 5SOTDRT0.951.050.750.850.10.20.350.10.20.951.050.5 5TO-220KC9.6510.677.679.250.641.021.
4、7-26.5131.244.83 5WCSP/NanoStarYZA1.351.450.850.950.150.190.5-0.850.950.5 5WCSP/NanoStarYZU1.251.750.951.450.250.350.5-0.951.450.75 5WCSP/NanoStarYEU1.251.750.951.450.250.350.5-0.951.450.75 5WCSP/NanoStarYEA1.351.450.850.950.150.190.5-0.850.950.5 5WCSP/NanoStarYEQ1.171.670.81.30.150.20.5-0.81.30.63 6SOP/SC-70DCK1.852.151.11.40.150.30.650.260.461.82.41.1 6SOP/SOT-23DBV2.831.51.70.250.50.950.350.552.631.45 6SOTDRL1.51.71.11.30.150.250.50.20.41.51.70.6 6SOTDRT0.951.050.750.850.10.20.350.10.20.951.0
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