半导体制造流程与ic产业链简介.ppt

Introduction on Fab flow and semiconductor industry - for IT related employee,Morris L. Yeh UMC.Fab8AB.PEI.Logic2,Outline,1. Fab flow and Transistor working,2. IC manufacturing chain,3. Filed application,4. The Trend,The Roadmap,1.1 Transistor Working,1. Whats the Transistor ?,2. Whats the Transistor structure ?,3. Hows the transistor working ?,4. Transistor and System revolution,3.1 Hows the clock running in the transistor ring?,3.2 Hows the information broadcasting in a system ?,1. Whats the Transistor ?,Transistor Working,In Digital application, the transistor play the role of switch in the system just like a mechanical switch , it means that the key component to storage the 0 and 1,State 1,State 0,But we deployed the Solid-State and Quantum physics to realize the solid-state switch - Transistor in silicon industry, its more size shrinkage, high speed, high performance and lower energy required than the prior arts.,State 1,State 0,2. Whats the Transistor structure ?,Transistor Working,LDD,POLY,The transistor included 3 terminal which likes the switch : 1. Poly Gate play the role of control or input terminal, the Drain play the role of output terminal and the Source play the role of reference or ground.,3. Hows the transistor working ?,Transistor Working,Voltage on the Drain terminal (output),=,In the Digital application, the transistor behaviors more likes a Capacitor : 1. Drain Bias ( Capacitor Charge ) : The charge storage on the Drain side. 2. Gate Bias ( Capacitor Discharge ) : The storage charge flow from Drain to Source 3. Drain Bias again ( Gate floating, Capacitor Recharge ) : The charge storage again.,3.1 Hows the clock running in the transistor ring?,The video shown the 49 stages NOT gate series which constructed the ring oscillator, In the left NOT gate diagram, if the input terminal become state 0, the PMOS was turn ON, and NMOS turned off, it means that the Vcc flow into Output terminal, the Output state become 1, and according quantum physics, the current flow the channel means that electron-hole pair recombination, and the light emission will be detected by the cooled infrared camera. The Ring Oscillator was the tool to measure the system clock and speed.,3.2 Hows the information broadcasting in a system ?,Generally, theres a few people could understood the information broadcasting in a chip, especially on the system debug, the product engineer hard to detect the defect in system level. The liquid-nitrogen-cooled infrared Camera could detect the hot spot emission which generated by the electron-hole pair combination. The defect could be detected once the signal flow to the defect node, the system will be hold and hot spot frozen on the defect node.,FIG. 1. The first transistor. Brattain and Bardeen's pnp point-contact germanium transistor operated as a speech amplifier with a power gain of 18 on December 23, 1947. (Bell Labs, Lucent),FIG. 3. The worldwide smallest transistor Gate length 0.061 um. (Bell Labs, Lucent),FIG. 2. The UMC post generation 0.25um standard transistor ( UMC ),4.1 The Transistor revolution,The First Transistor 1947 Bell labs.,The UMC 0.25um Transistor 1999, UMC,The worldwide leadship 2001 Bell labs. Lucent,Device Integration and Technology drive,1.2 Fab flow,1. Lithography concept and cycle,4. Transistor Layer (Front-end) definition,5. Routing Layer (Back-end) definition,3. Module composition and integration,2. Module definition,Lithography concept - physical cycle,ThinFilm-PHOTO-ETCH Physical layer formation cycle,Fab Flow,Lithography concept - Implant cycle,Diffusion-PHOTO- Diffusion Implant layer cycle,Fab Flow,1.2 Fab flow,1. Lithography concept and cycle,4. Transistor Layer (Front-end) definition,5. Routing Layer (Back-end) definition,3. Module composition and integration,2. Module definition,Photo: Raw material : Reticle, Photo Resist Equipment : I-Line(MUV), DUV, EUV (Stepper, SCANNER) Vendors: Nikon, ASML,2. Module definition - PHOTO,The PHOTO concept was general Optics lithography to reproduce the specific patterns. Today we deployed the UV Excimer laser for the light, According to Optics principle, generally the wavelength of the light should be less than one tenth of half pitch, so if the technology shrink, the Exposure light source should be pushed into deeply UV zone.,Thin-Film: Raw material : Metal Target, Chemical Equipment : Sputter, RTP, CVD (AP, PE, LP, SP, MO), Scubber Vendors: AMAT, Novellus, TEL, ASM,2. Module definition - Thin Film,In general we can split the Thin-Film into two field, one is Physics dominated (PVD), the other is Chemical dominated (CVD) The PVD means that no chemical reaction assisted in the process, just simply accelerated Ar atom to bombard the target to evaporate the target and deposit on the wafer, such likes Sputter. The CVD means that the chemical reaction on the wafer or chamber to deposit a film on the surface,CVD,PVD,Chemical reaction,Etch Raw material : Solvent, Reactive gas Equipment : Dr