1206红翠绿双色贴片LED灯珠规格书
承认书SPECIFICATION FOR APPROVAL客户Customer：客 户 品 号Customer P/N：鑫光硕品号Xgs Model：规格Specification :XGS-PB3216UEUG-04SMD 1206红翠绿双色 20MA制作Prepared By：李忠审核Checked By：Customer Confirmation 客户确认采购部Pur Dept By品质部QA Dept By工程部Eng Dept By深圳市鑫光硕科技有限公司SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD公司地址：广东省深圳市宝安区沙井万丰村前路31号8楼 一厂地址：广东省深圳市龙岗区嶂背创业二路18-1号二厂地址：广东省东莞市石排镇庙边王村沙迳工业区Tel: 13798585378 QQ:2373888283Website ：Http:/www.xgsled.cn E-mail:xzxgsled.cn· Customer:Technical Data SheetPN: XGS-PB3216UEUG-04 For: IF=20mAContents1.Features 2.Applications 3.Package dimensions4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range7.Package label 8.Soldering pad dimensions 9.Soldering conditions10. Package tape specifications11. Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions14.NoteCustomer confirmApproved byChecked byIssued byPart No.XGS-PB3216UEUG-04Emitted ColorRedBlueLen'sColorWater ClearChip MaterialAlGaInP/GaAsInGaN/GaN- - Features:Compatible with automatic placement equipment Compatible with reflow solder processLow power consumption and wide viewing angleThis product doesnt contain restriction Substance, comply ROHS standard. Applications:Automotive and TelecommunicationFlat backlight for LCD ,switch and symbol in telephone and fax General use for indicators Package Dimensions:Page 3 of 8Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT ResinUnit:mm Tolerance:±0.1Absolute Maximum Rating （Ta=25）ParameterSymbolValueUnitRGPower DissipationPM6080MwPulse Forward CurrentIFP125mADCForward CurrentIF20mAReverse VoltageVR5VOperating Temperature RangeTopr-4085Storage Temperature RangeTstg-40100 IFP condition: pulse width 1ms ,duty cycle 1/10Electrical Optical Characteristics（Ta=25）ParameterSymbolMinTyp.Max.UnitTestConditionLuminous IntensityIVRed70150-mcdIF =20mAGreen320600-Forward VoltageVFRed1.8-2.4VIF =20mAGreen2.8-3.4Reverse CurrentIRRed-10uAVR=5VGreen-10Dominant WavelengthdRed615625-nmIF=20mAGreen515530-Viewing Angle21/2Red-140-Deg.IF =20mAGreen-140-Notes: 1.Tolerance of Luminous Intensity±10% 2.Tolerance of Dominant Wavelength ±2nm3. Tolerance of Forward Voltage ±0.05V4. Luminous Intensity is measured by XGSs equipment on bare chips Soldering Pad Dimensions: Soldering Conditions(Maximum allowable soldering conditions)Reflow soldering profileTemperature<Pb-free solder>3/sec. 260 Max.10sec.Max.210Pre-heating 120160 3/sec.-4/sec.60120sec.120se.c.Max.Time Reflow soldering should not be done more than two times. Do not stress its resin while soldering. After soldering,do not warp the circuit board. Package Tape Specifications: (4000 pcs/Reel)Feeding, DirectionDimensions of Reel ( Unit: mm)Dimensions of Tape (Unit:mm)Arrangement of Tape(Unit:mm)Page 8 of 8 Typical Electro-Optical Characteristics Curves：Reliability(1) Test Items and ConditionsNOTest ItemTest ConditionsSampleAc/Re1Temperature Cycle-40±525±5100±525±5(30min，5min，30min，5min) 100 Cycles200/12High Temperature StorageTa：100±5Test time=1000HRS(-24HRS,+72HRS)200/13High Temperature AndHigh Humidity WorkingTa：85±5，RH:85±5%，IF=15mA Test time=500HRS(-24HRS,+72HRS)200/14Low Temperature StorageTa：-40±5Test time=1000HRS(-24HRS,+72HRS)200/15Operating Life TestConnect with a power IF=20mA Ta=Under room temperatureTest time=1000HRS(-24HRS,+72HRS)200/16Thermal Shock-40±5100±5(15min，15min) 100 Cycles200/17IR-Reflow Pb-Free Process 80 100 120 160 170235270255， 60cm/min，2 times200/1(2) Criteria of judging the damageItemSymbolTest conditionCriteria for judgementMin.Max.Forward voltageVFIF=Test Current/U.S.L*1.1Reverse currentIRVR=5V/15uALuminousintensityIVIF=Test CurrentL.S.L*0.7/Wave lengthD/PIF=Test Current/U.S.L±2nmAppearance/View checkNo mechanical damage* U.S.L: Upper standard levelL.S.L: Lower standard level Cautions1、PackageWhen moisture is absorbed into the package it may vaporize and expand during soldering. There is apossibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the
