SMD双色LED灯珠- 1206红黄绿双色贴片LED灯珠规格书下载
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SMD双色LED灯珠- 1206红黄绿双色贴片LED灯珠规格书下载
承认书SPECIFICATION FOR APPROVAL客户Customer:客 户 品 号Customer P/N:鑫光硕品号Xgs Model:规格Specification :XGS-PB3216UEAG-04SMD 1206红黄绿双色 20MA制作Prepared By:李忠审核Checked By:Customer Confirmation 客户确认采购部Pur Dept By品质部QA Dept By工程部Eng Dept By深圳市鑫光硕科技有限公司SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD公司地址:广东省深圳市宝安区沙井万丰村前路31号8楼 一厂地址:广东省深圳市龙岗区嶂背创业二路18-1号二厂地址:广东省东莞市石排镇庙边王村沙迳工业区Tel: 13798585378 QQ:2373888283Website :Http:/www.xgsled.cn E-mail:xzxgsled.cn· Customer:Technical Data SheetPN: XGS-PB3216URAG-04 For: IF=20mAContents 1.Features 2.Applications3.Package dimensions 4.Absolute maximum rating5.Electrical optical characteristics 6.BIN range7.Package label 8.Soldering pad dimensions 9.Soldering conditions10. Package tape specifications11. Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions14.NoteCustomer confirmApproved byChecked byIssued byPart No.XGS-PB3216UEAG-04Emitted ColorSuper RedSuper GreenLen's ColorWater ClearChip MaterialAlGaInPAlGaInP- Features:Compatible with automatic placement equipment Compatible with reflow solder processLow power consumption and wide viewing angleThis product doesnt contain restriction Substance, comply ROHS standard. Applications:Automotive and TelecommunicationFlat backlight for LCD ,switch and symbol in telephone and fax General use for indicators Package Dimensions:Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT ResinPage 5 of 11 Absolute Maximum Rating (Ta=25)ParameterSymbolValueUnitUEAGPower DissipationPD6060mWPulse Forward CurrentIFP100mADCForward CurrentIF20mAReverse VoltageVR5VOperating Temperature RangeTopr-4085Storage Temperature RangeTstg-40100l IFP condition: pulse width 1ms ,duty cycle 1/10ParameterSymbolMinTyp.Max.UnitTestConditionLuminous IntensityIVRed60120-mcdIF =20mAGreen2060-Forward VoltageVFRed1.8-2.4VIF =20mAGreen1.8-2.4Reverse CurrentIRRed-10uAVR=5VGreen-10Dominant WavelengthdRed616-628nmIF=20mAGreen566-576Viewing Angle21/2Red-140-Deg.IF =20mAGreen-140- Electrical Optical Characteristics(Ta=25)Notes: 1.Tolerance of Luminous Intensity±10% 2.Tolerance of Dominant Wavelength ±2nm3. Tolerance of Forward Voltage ±0.05V4. Luminous Intensity is measured by xgss equipment on bare chips BIN rangeLuminous intensity (tolerance is±10% If =20mA/chip ):BIN CODEMin.(mcd)Max. (mcd)UEK6080L80100M100130N130160AGF2027G2735H3545J4560Dominant Wavelength (tolerance is±2nm If =20mA/chip):BIN CODEMin.(nm)Max. (nm)UED616619E619622F622625G625628AGH566568J568570K570572L572574M574576Forward voltage (tolerance is ±0.05V If =20mA/ chip):BIN CODEMin.(V)Max. (V)UE AGF1.81.9G1.92.0H2.02.1J2.12.2K2.22.3L2.32.4 Soldering Pad Dimensions: Soldering Conditions(Maximum allowable soldering conditions)Reflow soldering profileTemperature<Pb-free solder>3/sec. 260 Max.10sec.Max.210Pre-heating 120160 3/sec.-4/sec.60120sec.120se.c.Max.Time Reflow soldering should not be done more than two times. Do not stress its resin while soldering. After soldering,do not warp the circuit board. Package Tape Specifications: (3000 pcs/Reel)Page 9 of 11 Typical Electro-Optical Characteristics Curves: Reliability(1) Test Items and ConditionsNOTest ItemTest ConditionsSampleAc/Re1Temperature Cycle-40±525±5100±525±5(30min,5min,30min,5min) 100 Cycles200/12High Temperature StorageTa:100±5Test time=1000HRS(-24HRS,+72HRS)200/13High Temperature AndHigh Humidity WorkingTa:85±5,RH:85±5%,IF=20 Test time=500HRS(-24HRS,+72HRS)200/14Low Temperature StorageTa:-40±5Test time=1000HRS(-24HRS,+72HRS)200/15Operating Life TestConnect with a power IF=20mA Ta=Under room temperatureTest time=1000HRS(-24HRS,+72HRS)200/16Thermal Shock-40±5100±5(15min,15min) 100 Cycles200/17IR-Reflow Pb-Free Process 80 100 120 160 170235270255, 60cm/min,2 times200/1(2) Criteria of judging the damageItemSymbolTest conditionCriteria for judgementMin.Max.Forward voltageVFIF=Test Current/U.S.L*1.1Reverse currentIRVR