打线模拟
,Lead,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Lead,ESEC,air drag,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Lead,ESEC,ESEC,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,ball search height,Hieght speed,Low speed,Low speep,ESEC,touch down,ESEC,ESEC,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Lead,Lead,ESEC,ESEC,ESEC,ESEC,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Bondparameter: Force, US-power, Temp.,Lead,Chip,ESEC,ball security height,ESEC,ESEC,ESEC,ESEC,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,ESEC,ESEC,ESEC,ESEC,ESEC,ESEC,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,reverse loop,Lead,peak height,ESEC,ESEC,ESEC,ESEC,ESEC,ESEC,ESEC,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Lead,Non stick detector,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,wedge search height,Lead,ESEC,Wire Bonding,touch down,Lead,Chip,created by Heinrich Berchtold - ESEC(Europe)SA,Lead,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Bondparameter: Force, US-power, Temp.,Lead,ESEC,Chip,Wire Bonding,tail formation,created by Heinrich Berchtold - ESEC(Europe)SA,ESEC,Chip,Lead,Wire Bonding,EFO blade act,created by Heinrich Berchtold - ESEC(Europe)SA,EFO spark,Chip,Lead,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Lead,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,Chip,Lead,ESEC,Wire Bonding,created by Heinrich Berchtold - ESEC(Europe)SA,