04-03-0003_002 Wafer Handling (R)...
价格:1金贝
Comparison of the InP wafer major flat finish from three vendors...
SOP for Making Grating Lithography Photoresist...
04-03-0007_002 Final Clean for Wafer Delivery (MBE Ready) and Pre-Clean (Grating) Work Instruction (R)...
04-03-0006_001 Grating Lithography Photoresist Preparation Work Instruction (R)...
RDBH-BL-3.5.0=50nm_uidPNINXumFe6E16_624_624Growth_EtchStop...
RDBH-BL-5.0.2=50nm_uidPINStructureP=8E17_1.88umRegrowthNoEtchStop...
RDBH-BL-4.0.1=75nm_uidPNLandmarkStructurP=8E17e_1.7umRegrowthNoEtchStop...
RDBH-BL-5.1.1=50nm_uidPNStructureP=5E16RegrowthNoEtchStop...
RDBH-BL-5.3.0=50nm_uidPNStructureP=1.0E18_VariableRegrowthNoEtchStop...
RD-RWG-Cladding-1.0.1=1300nmInP8E17-2E18100nmInGaAs...
RD-BH-Cladding-1.0.2=2500nm etch stop...
RD-BH-Cladding-1.3.1= 3205nm1.2-3E18Be1.1QEtchStop_Updated...
RD-BH-Cladding-1.4.0= 3205nm1.2-3E18Be1.1QEtchStop300nmInGaAs...
RD-BH-Cladding-1.0.3=2500nm no etch stop...
RD-BH-Cladding-1.0.4=2500nm_LowerDoping...
RD-BH-InGaAs_Cap-1.1...
RD-BH-Cladding-1.1.0= etch stop...
RDBH-BL-3.4.4=200nm_uid1.95umFe6E16_624_624Growth_EtchStop...
RD-BH-Cladding-2.0.0=500 nm Morphology Check...